Electronics Forum | Tue Aug 12 11:12:23 EDT 2008 | rafacadiz
What is the plating of the component leed ?, looks like the component need more T�, perhaps you are using leed free component with SnPb solder paste at 220 �C.
Electronics Forum | Tue Nov 18 19:14:04 EST 2008 | swag
We had very similar solderability problem with TI P/N SN74LVC2G34DCKR.
Electronics Forum | Mon Aug 31 11:40:23 EDT 2009 | rossi
We have tried 2. The first is 244C and the 2nd is 252C. The processor BGA document recommends a solder temperature above 250C. Eric
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Wed Aug 24 16:03:23 EDT 2005 | avalancher
Sounds to me like you have one of two problems. First would be the pasting of the board. Possiblilty exists that the machine/operator didn't wash the stencil thouroughly, causing a permanent partial blockage in that one corner. Second thing could be
Electronics Forum | Fri Jun 17 23:31:12 EDT 2005 | kenscj
Hi all, currently, we are seeing BGA problem like solder ball misalign, void, solder short (all under BGA, tested with 5DX), after reflow. We examine the solder ball (raw material of BGA), and see that the ball surface is not smooth, will that affe
Electronics Forum | Wed Sep 19 07:19:46 EDT 2012 | mbnetto
Hi Melissa, We mount this component in the bottom side with adhesive epoxy and the solder is done on the wave solder machine. During the wave solder machine, we have the problem as like the picture.. no solder in one of the pads...
Electronics Forum | Thu Feb 17 14:00:30 EST 2011 | aribeiju
We have a problems with soldering in the PCB in the Solder Wave process. Our pcbs are failures in the solder (voids) in the throughole components. The main problems is in varistor components. what are the soluctions to problems? tks
Electronics Forum | Tue Dec 13 22:44:35 EST 2005 | Mike Kennedy
Russ, After a bit more research, I have found that the FLASH gold process doesnt use Phophrous in the process so should not have the black pad problems of ENIG. I am now surprised that you had problems. What did you experience? Was it an oxsidisation
Electronics Forum | Thu Aug 25 11:45:42 EDT 2005 | slthomas
I would attack the simplest possibility first. Make SURE you have enough solder paste going on the pads. If you don't, not only will you not have enough solder to make a good fillet, but you might not have enough flux available to allow what little s
.png)