Electronics Forum | Wed Dec 08 12:48:01 EST 1999 | Chuck C.
Is anyone out there having problems with noise in analog circuits caused by the residue that no-clean solder paste leaves after reflow? If so do you have any suggestions on how to eliminate the problem??
Electronics Forum | Tue Jan 28 17:23:11 EST 2003 | C. M. Gabel
I am working with a BGA package. The laminate layer is being modeled as BT-Cu smear. The thermal conductivity of BT is 0.19 W/mK. Does anyone know what the density and specific heat values are for BT?
Electronics Forum | Fri Jun 02 17:43:17 EDT 2000 | Dave F
James: I believe Delmat is a proprietary product. Check with some of the solder fixture fabricators in the archives. Continuing, I would not select knowingly Delmat as a board stiffener. It's a composite material similar to oriented strand board
Electronics Forum | Tue Dec 28 03:59:06 EST 2010 | riscy00
I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density. Has anyone
Electronics Forum | Mon May 22 03:24:37 EDT 2006 | slaine
Hi below is a link to a database set up that list the properties of all SAC alloys, worth reading. http://www.europeanleadfree.net/POOLED/DOCUMENTS/a178886/ELFNET_COST531_Solder_Alloy_Properties_Database_v1.pdf its from http://www.europeanleadfree.
Electronics Forum | Mon Jun 25 20:35:44 EDT 2001 | davef
According to J-STD-004 "Requirements for Soldering Fluxes", fluxes are classified by their chemical composition, activity level and halide content. In this scheme, each flux type is identified by a 4-character designator, where: * First two character
Electronics Forum | Tue Mar 20 09:31:56 EST 2001 | PeteC
I dunno.: e�lec�tro�lyt�ic Of or relating to electrolysis. Produced by electrolysis. Of or relating to electrolytes. e�lec�trol�y�sis Chemical change, especially decomposition, produced in an electrolyte by an electric current. Destruction
Electronics Forum | Wed Jan 30 09:41:36 EST 2013 | eniac
I think, the target is one - restore the properties of solder paste. Fluxing properties, adhesive ability is main.
Electronics Forum | Wed Jul 27 09:47:01 EDT 2005 | GCampbell
CEMCO Uk have done testing using SACX0307, SAC305 and Sn/Cu/Ni. The copper dissolution tests (report available) conducted at CEMCO showed that the lowest copper erosion rate was achieved by SACX0307. Regards Gerry
Electronics Forum | Mon Aug 09 05:39:43 EDT 1999 | Jacqueline Coia
Could anyone please tell me if the now redundant 'Probimer 52' PCB soldermask has an alternative being used which has the same look and properties as Probimer 52, without being as harmful. If so could you tell me where to find details on this new ma
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