Electronics Forum | Fri Nov 02 12:49:33 EDT 2018 | robl
Has anyone tried producing domed joints for high voltage corona reduction on a selective solder machine? I'm guessing it probably won't work due to gravity, but worth a shout. Thanks, Rob.
Electronics Forum | Thu Dec 14 04:42:11 EST 2017 | jineshjpr
Can anybody suggest how can I achieve good solderability in convectional reflow oven If I reduced Convection Air Speed 80%. The whole purpose is to reduce 0402 LED tilting in the convectional reflow and the PCB having QFN with 60 to 120 sec soak, 30
Electronics Forum | Wed Dec 20 07:16:16 EST 2017 | stephendo
I agree with Evtimov. What he didn't point out is that the surface tension of the solder would vastly overwhelm any force from air flow.
Electronics Forum | Wed Feb 07 16:14:54 EST 2001 | Antonio
I've recently read a posting here which said that the person was trying to reduce solder balls. One of the things the person had done was to adjust the reflow profile so as to be hotter and longer in the reflow state. Am I wrong here? I thought th
Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She
Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan
Electronics Forum | Tue Dec 31 02:04:19 EST 2019 | sssamw
From the picture, I cannot see clearly solder ball violate electrical clearance or cause a short, maybe it is. What I can see is the solder paste has some misalignment although it doesn't printed in solder mask area, but actual position will reduce
Electronics Forum | Sat Feb 06 07:14:40 EST 2021 | agoesfirmanto
Dear Sirs, very sorry being late reply after a year. Thank you very much for your advices, you are absolutely correct after reduce grounding pad size. No more solder ball issue. Thank you very much. highly appreciate all of your supports. Best re
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Sat Aug 05 12:12:05 EDT 2000 | Ramon I Garcia C
Hello Friends: I'm new in SMT process, I have a problem with little balls of solder beside of the component, I'm tried reducing the apertures in the stencil and making home base, some times the balls desappear, but some time not, and some times
