Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef
Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Tue Jul 19 14:33:17 EDT 2011 | ccouture
Has anyone tried using a product thet when applied to a stencil, it facilitates the release of solder paste from the stencil, including the fine pitch openings. It makes the stencil's surface "fluxophobic". Same principle as Rain-X for windshield. A
Electronics Forum | Wed Jul 20 05:49:45 EDT 2011 | kenneth0
I think you are referring to nano coatings. Try google nano coated stencils
Electronics Forum | Thu Mar 23 06:38:30 EST 2006 | pavel_murtishev
Good afternoon, We can use type-3 solder paste, but what for? Type-3 solder particles are larger than type-4. Probably this will cause even worse release. BR, Pavel
Electronics Forum | Tue Jan 21 13:51:19 EST 2014 | rgduval
Armando, Is the problem in the same spot on the board with every run? If so, there might be something about that particular location that is part of the cause (ie. ground or power plane connection). It sounds like you're seeing blow holes, or insu
Electronics Forum | Fri Apr 29 14:00:40 EDT 2011 | ppcbs
Our company is finishing up a design prototype for an easy to use re-balling fixture. 100% ball attach, and you can re-ball more than one BGA at a time. Initial investment will be in fixture cost, but you will be able to re-ball several chips in ar
Electronics Forum | Fri May 21 15:50:41 EDT 1999 | John Thorup
We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendors
Electronics Forum | Fri Apr 30 15:13:55 EDT 2004 | SWagner
You could comprimise on the E-Fab stencil and buy a laser cut nickle, it will have similar release characteristics to an E-Fab and only costs $600, they can be purchased from Stork Veco, they are located in Europe.
Electronics Forum | Tue Mar 21 08:22:11 EST 2006 | jdengler
If you usually get good release on other products with your paste, I would try a different batch of paste. The batch you are using may have a problem that contributes to the beading. Jerry
