Electronics Forum | Tue Sep 01 19:16:51 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Wed Sep 09 05:10:38 EDT 1998 | Pedro Costa
Hi, I work at a service department in Portugal and we are recently ISO9002 compliant. After our 2 billion audits, they asked us to improve our soldering documentation by joining information on soldering and desoldering regular and SMD IC's, like: max
Electronics Forum | Wed Jul 14 13:41:40 EDT 2010 | rway
We are running SMT products and have been for some time now. First, I wanted to check with you folks to see what an acceptable FPY rate, or what you would consider and acceptable rate, is. Secondly, we are having issues primarily with product that
Electronics Forum | Mon Nov 15 10:30:59 EST 1999 | Michael Vyskocil
We took Orbotech and Viscom into short-list. Both systems uses angular cameras to inspect solder joints. I'm also very interested to hear any experiences and posted the ORBOTECH vs. VISCOM message some days earlier.
Electronics Forum | Fri Jun 30 14:18:14 EDT 2006 | jdumont
We had been using the Kester Easy profile 256 paste and recently switched to the 256 HA (high activity) paste. Ive seen a reduction in shorts and better wetting on our more difficult to solder components. Both related to one another but both positive
Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson
Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi
Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson
Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi
Electronics Forum | Wed Aug 27 14:58:21 EDT 2008 | omid_juve
we have problem in setting the density of a no clean flux for using before wave soldering . first we dilute the flux but we have many short circuit problem between the pads of edge connector,then we densify the flux all the short circuit is removed b
Electronics Forum | Wed Jun 18 16:03:03 EDT 2003 | mkehoe
Orrrrr, just buy a small reflow oven, 5K to 7K, and eliminate the paste printing by using solid solder deposition. No shorts, no opens, no cleaning, and no voids. www.sipad.com If you decide to print your own paste later you can invest the extra 30
Electronics Forum | Wed Dec 13 11:11:20 EST 2000 | CAL
CONFUSED???? The the "BIG-chip-in-the-middle" on my image is IC732. IC304 is the 52pin QFP to the right of the "BIG-chip-in-the-middle".If it worked when the "Thingy" was there and does not work when the "thingy" is not there good indications are you
