Electronics Forum | Mon Nov 02 22:02:01 EST 2009 | boardhouse
Umar - the boards are not assembled - so Solder splash is not applicable. Solder resist does not Melt it cures. As a board supplier I would not want my clients to adapt if they are receiving crap product, I would expect them to leave.
Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar
Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr
Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan
Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ
Electronics Forum | Fri Oct 30 10:36:26 EDT 2009 | richie_puthotta
Hi, I see a huge solder mask shift on chip comp pads. This would result in mid-chip solder balls or solder beads. Overall, the solder mask workmanship is not acceptable. Mask is on pad.
Electronics Forum | Tue Nov 03 06:23:12 EST 2009 | josh_brubaker
Has anyone ever done a tape test to see if the solder resist pulls away from the PCB? Is this an acceptable method for testing solder resist acceptability? This is an issue I am experiencing with our PCBs. I am receiving boards with excess solder o
Electronics Forum | Tue Oct 27 22:52:18 EDT 2009 | davef
Top picture: We're not wild about the 'poor registration,' the differing thickness of the solder mask, and the crud all over the board. But, then again, we don't have a basis for rejection. Bottom picture: No basis for rejection Help us out, what do
Electronics Forum | Sun Nov 01 01:33:52 EST 2009 | isd_jwendell
Just my opinion: Top pic - Solder mask registration WAY too far off, without a doubt I would reject. Bottom pic - I would worry that there was/is a contamination that caused the poor looking mask. This may be cosmetic only, but unknown. I would rej
Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse
Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Electronics Forum | Tue May 25 18:08:19 EDT 2021 | scarittagle
A certain degree of cleanliness is needed in SMT manufacturing environment but not as overkill as place it in a "clean room" environment... Yes, dust could cause defect on PCBAs (and there are research papers about it too) but onl
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