Electronics Forum: solder splash during solgering (Page 1 of 2)

Solder splash from component terminal

Electronics Forum | Wed Mar 22 14:59:20 EDT 2017 | solderingpro

Hello Henry, I believe some further clarification may be needed for someone to assist. Is the component already soldered prior to reflow? Does the component have paste already applied going through reflow? (or as per my previous question, is it al

solder splatter inspection

Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef

You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu

Solder Ball and Splash after Hand Soldering

Electronics Forum | Fri Jul 24 23:20:11 EDT 2009 | umar

Hi Dave, Thanks on your feedback, May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ?

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Tue Jan 19 10:18:58 EST 2021 | grahamcooper22

Hi, try a low spitting cored wire...something like ALMIT SR-LA cored wire...or SR-LA SUPER...it eliminates flux/solder spitting during soldering.

Solder splashes on gold

Electronics Forum | Mon Sep 29 23:46:51 EDT 2003 | daman

Hello everybody, We have a new product having a lot of open gold area. solder splashes during the reflow is a pain in the... Its an extremely small PCB and kapton taping is not an option. Stencil is at 10% reduction, Cleaning after every cycle. Reflo

Re: Solder Splash

Electronics Forum | Thu Sep 02 12:40:55 EDT 1999 | John Thorup

| Dear Netters, | | Can you kindly suggest what cause solder splash in IR reflow boards ?? What are the main causes normally ?? | | | Best Rgds, | Felix | Felix - we need a better description of what it looks like. If it's a spray, usually balls

How to prevent COB pad free from contamination

Electronics Forum | Mon Mar 17 07:00:34 EDT 2008 | ectan5117

Hi, During SMT process, i found that solder splash on the gold pad. The distance between the COB pad with component pad is about 1.25mm. My question is what material can used to cover the COB pad without bringing contamination. And i am welcome to

defects in pcb manufacturing

Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar

Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr

LGA and Solderballs

Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef

J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause

BGA 3D inspection feedback

Electronics Forum | Sat Oct 15 01:47:09 EDT 2022 | auriga2001

I might need some help to explain what I'm seeing here. The first 3 look like before pictures. They seem ok. The last 3 look like after pictures. It doesn't look like fracturing joints as would be a normal failure for vibration test, more like it rea

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