Electronics Forum | Wed Mar 22 14:59:20 EDT 2017 | solderingpro
Hello Henry, I believe some further clarification may be needed for someone to assist. Is the component already soldered prior to reflow? Does the component have paste already applied going through reflow? (or as per my previous question, is it al
Electronics Forum | Thu Nov 14 03:12:42 EST 2019 | jefri_simorangkir
hi Team, observed excess solder after assembly jumper with manual solder method. I already try to duplicate the phenomenon with adding more solder tin/wire,adding more time for solder but not found same condition I have attached the image for the
Electronics Forum | Mon Nov 25 18:16:40 EST 2002 | Dreamsniper
What really happens during the oxidisation process during reflow soldering? Where does the oxide goes...mix with flux etc...Is there a tin-oxide and lead oxide during the process? I believe that during wave soldering the oxides become dross...but wha
Electronics Forum | Tue Aug 28 15:13:17 EDT 2007 | rgduval
Lead-free? White-tin finish? Even if it's not, it sounds like a moisture/contamination issue. If your boards must sit in stock between reflow/wave, consider giving them an alcohol bath to clean up any contamination, and a good baking to remove any
Electronics Forum | Thu Sep 27 10:40:46 EDT 2007 | rgduval
Joris, Yep, very common to have those small blow holes in lead-free alloys. We used to get them very consistently on white-tin finished boards, and less frequently with gold finished boards, for what ever that is worth. IPC-610 actually allows t
Electronics Forum | Thu Sep 27 10:53:59 EDT 2007 | gregoryyork
Joris, > > Yep, very common to have those small > blow holes in lead-free alloys. We used to get > them very consistently on white-tin finished > boards, and less frequently with gold finished > boards, for what ever that is worth. > > IPC-6
Electronics Forum | Thu Feb 25 20:25:16 EST 2010 | dean
Good question, the answer as of right now is yes. Our machine is only able to go down to 0402 parts before the surface tension of the solder begins to cause issues with maintaining the placement position of the part on the nozzle. However, we are dev
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef
You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu
Electronics Forum | Mon Jun 21 14:55:27 EDT 1999 | JohnW
| | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | for example: | | | | Solder Bridge | | 1.verify amount of flux been aplied. | | 2.verify turbulance on your solder w
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