Electronics Forum | Fri Apr 16 19:32:07 EDT 2021 | mcoass
Hello, I have a very strange problem in a Delta 3 vitronic soltec, drops of tin are fired from the solderpot, I already adjusted the flux profile but these tin stains continue to appear, B.R
Electronics Forum | Wed Feb 28 19:48:11 EST 2001 | davef
If we were talking about a single board problem, we�d be thinking about the laminate, but since you imply the problem is broad-based across multiple assemblies, consider the following machine parameters: * Crank-up preheat time / temperature to driv
Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean
I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Tue Nov 19 15:18:28 EST 2002 | gswable
does anyone have concrete data on the reliability of lead free components-SN/Bi used with tin lead paste thanks
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Mon Feb 27 06:42:37 EST 2006 | Slaine
What are the long term issues with high tin content solders on parts plated with silver over copper? Is it possible that the silver will be absorbed by the solder then over a long period of time the tin will react with the copper causing it to part
Electronics Forum | Tue Jun 06 19:03:59 EDT 2017 | zsoden
Hi Steve, I just confirmed with the manufacturer and the HASL is tin/lead (or it is supposed to be, at least). Any suggestions for how to test for nickel vs tin/lead? We're using an alcohol based no-clean flux from Alpha.
Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef
Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass
Electronics Forum | Fri Mar 23 10:00:38 EDT 2012 | isd_jwendell
I am a big fan of AIM SnPb solder paste. I currently use NC257-2 (no-clean, 89.5%), and recommend you include it in your evaluations.
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