Electronics Forum: solder temperature in selective soldering (Page 11 of 33)

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera

Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo

Reducing Wave solder DeltaT

Electronics Forum | Wed Jan 27 11:58:35 EST 2010 | randyw

Our products are a mixed technology; with both surface mount components solder side and through-hole top side, in addition to massive heat sink assemblies. We have been using your SN100C solder in our wave solder process with Multicore MFR301 Flux si

Coolingproblem in reflow profile

Electronics Forum | Thu Jun 16 22:33:54 EDT 2005 | davef

Peter: Please explain: * You say, "The cooling phase is important to perform the strength of the solder joint." [We agree that fast cooling rates produce fine grain in solder and that fine grained solder connections are stronger than coarse grained.

Re: wave solder process

Electronics Forum | Thu Jun 17 20:35:51 EDT 1999 | Earl Moon

| | | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | | | for example: | | | | | | Solder Bridge | | | 1.verify amount of flux been aplied. | | | 2.verify turbulance on

Bga pad remaning solder

Electronics Forum | Mon Aug 23 16:37:22 EDT 2004 | Terry

Three methods, all work, all require generous use of flux. 1.) Use a heated, electrical desoldering tool with flux. Just be sure that you select a forgiving desoldering tip with a rounded tip end to it so that you do not scratch the pad. Advantage:

Re: wave solder process

Electronics Forum | Mon Jun 21 14:55:27 EDT 1999 | JohnW

| | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | for example: | | | | Solder Bridge | | 1.verify amount of flux been aplied. | | 2.verify turbulance on your solder w

solder paste volume spread

Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef

Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli

Re: wave solder process

Electronics Forum | Thu Jun 17 15:18:54 EDT 1999 | Earl Moon

| Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | for example: | | Solder Bridge | 1.verify amount of flux been aplied. | 2.verify turbulance on your solder wave. | 3.etc.

Re: wave solder process

Electronics Forum | Thu Jun 17 19:52:57 EDT 1999 | Tony

| | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | for example: | | | | Solder Bridge | | 1.verify amount of flux been aplied. | | 2.verify turbulance on your solder w

sales rep's in Argentina

Electronics Forum | Mon Jan 17 14:31:09 EST 2000 | Scott McAnall

I have been asked to find a sales rep organization in Argentina. Does anyone out there have anyone, we manufacture selective soldering and solderability test systems.


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