Electronics Forum: solder temperature in selective soldering (Page 12 of 33)

Air Moisture in Production

Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef

3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire

Via in pad

Electronics Forum | Fri Jun 11 08:38:55 EDT 2004 | davef

We figured you were going to say that. Pay me now, or pay me later, you call it. As an alternative: * Cover the backside of the via with masking tape that will take soldering temperature, like Kapon, or a temporary solder mask * Enlarge the apertur

Re: solder balling

Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis

Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal

Void in CSP

Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef

Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;

Bubbles in conformal coat

Electronics Forum | Thu Aug 27 11:35:07 EDT 2009 | davef

There are many possibilities: * Conformal coat is incompatible with surface residue on the board * Conformal coat is incompatible with solder mask on the board * Moisture is out-gassing from the board * Conformal coat is too thick and does not allow

Porosity in Good Plating

Electronics Forum | Sat Jul 05 07:30:04 EDT 2003 | AlCapone

If the problem as you described as the gold plating contaminated, and the Nickel layer exposed to the solder pot. However, the purpose of the gold layer is to protect the nickel and copper layer not turn into corrosion and resist to other issue (humi

problem in solderability

Electronics Forum | Fri Aug 29 10:23:30 EDT 2008 | vladig

Everyone has been playing a guess game so far :-) but we don't even know what the lead finish is:-) Even old (Sn-Pb finish) days, the ammount of Pb in the plating would be on a single digit level (just to mitigate Sn-whiskers growth), meaning that th

Pin in Paste assistance

Electronics Forum | Thu Dec 03 21:40:01 EST 2020 | itmconsulting

Hey Kyle - Good for you for pushing your horizons and considering pin-in-paste (aka "Intrusive Soldering"). Don't let the nay-sayers out there discourage you. When I encounter mixed tech PCBAs (SMT and through-hole) my first choice, if the design a

Pin in Paste assistance

Electronics Forum | Tue Sep 29 21:39:07 EDT 2020 | kylehunter

Hi, We are currently working on a board that has 3x 50-pin THT at 1.27mm pitch each. This is too small for us to be able to consistently do on our selective solder. We are instead considering pin in paste. The connector we are using can be spec'd at

Re: paste in hole

Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies

Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi


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