Electronics Forum | Wed May 08 11:07:54 EDT 2002 | Carol Stirling
We have a concern with moisture absorbtion/humidity effects on PWBs specifically used for automated SMT (including BGA). I'm sure there is a IPC spec on this and would appreciate the number - I've searched the IPC web-site -no results. Could you t
Electronics Forum | Fri Nov 22 16:55:30 EST 2013 | hegemon
Head and Pillow defects beneath a BGA are difficult to find, no matter what the equipment is on hand. Since you do not appear to have access to tools that would help you, or $$ to purchase said tools, I might recommend that you use an outside source
Electronics Forum | Mon Feb 03 22:48:00 EST 2003 | vinesh
Hi all, We are using small CSPs (10x10mm) in one of our products which has a big ground pad in the center (7x7mm). The maximum voiding allowed on this big pad is also no greater than 25% which we are finding very hard to achieve. The centre pad ha
Electronics Forum | Tue Aug 31 20:41:45 EDT 1999 | Dreamsniper
| | I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average r
Electronics Forum | Thu Apr 27 08:42:22 EDT 2017 | pvasquez
Hello M. We are a low volume high mix manufacturer with a total of 7 Mirtec AOI machines including a new MV-6 OMNI 3D system. I am very pleased with this machine! When we did our 3D AOI research, my team narrowed the field down to 2 vendors, Mirt
Electronics Forum | Wed Dec 19 09:41:14 EST 2012 | dyoungquist
What is your solder pot temperature? We found that on a 0.093" multilayer board increasing the temp of the lead free solder from 300C to 315C helped with the barrel fill.
Electronics Forum | Wed Jun 21 13:25:16 EDT 2006 | muse95
I see what you're saying - I'm not a process guru by any means. I was going on the premise that SAC melts at a higher temperature than SnPb. Basically I think of it as a BGA is joining solder to solder, unlike an SOIC where it is tinned metal lead t
Electronics Forum | Mon Aug 03 15:04:03 EDT 2009 | davef
We know nothing about your: * Solder alloy * Materials of your board * Materials of your teminal block * Process setup of your wave * Wetting condition of the board or the terminal block ... but we'll take a guess anyhow. Tin-copper based solder all
Electronics Forum | Mon Jan 07 12:12:55 EST 2008 | ck_the_flip
Another thing I'm curious about. What is the "functional purpose" of soldering stainless? Solder coatings generally prevent oxidation on surfaces, but why would somebody solder STAINLESS? Stainless, by nature, is resistant to rust, and hence, oxid
Electronics Forum | Tue Dec 08 12:44:52 EST 2020 | janwillemreusink
Who is using two sorts of tin in one selective soldering machine with to solder pots? So then the soldering program selects the correct pot (tin). What are the risks? Adding wrong tin in the wrong pot. Mixing up the nozzles?
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