Electronics Forum | Tue Jun 27 09:25:55 EDT 2006 | aj
How does SN100C perform using Selective Pallets? We switched over to SACX about 5 weeks ago and the results are brilliant. We are getting better results than before believe it or not. Also dross foramtion is a lot less. aj...
Electronics Forum | Tue Jun 27 16:05:33 EDT 2006 | grantp
Hi, Do you mean selective palettes in the wave? We are running those, and it makes the process window tight, but once we got there, it's great. Pre heating the board was a bit difficult, but we got it right, and went for a water based flux. Not sure
Electronics Forum | Thu Sep 21 21:00:21 EDT 2000 | Dave F
Well, I'm going to assume you: * Have a nichel barrier between the copper on your board and the gold / solder solution * Use a lead / tin near euthectic solder If so, I pick "C" - It doesn't matter. When concerned about copper tin intermetallics, t
Electronics Forum | Tue Nov 08 20:58:49 EST 2005 | davef
We buy humidity as a potential cause of solder balls, but we're not biting on dewetting. Something else is causing that. Questions are: * What's the temperature and RH of your SMT production area? * What kind of paste are you using? [Some water was
Electronics Forum | Wed Nov 09 02:24:49 EST 2005 | laxman
Hi Dave, Normally in our country (India) during rainy season the temperature will be 25to 30 �C and RH of 50 to 60%. The reason behind this humidity issue is that recently we have moved to our new facility with centralised air conditioner with Chill
Electronics Forum | Thu Jun 08 19:51:22 EDT 2006 | grantp
Hi, That's good news, and we did outs with SN100C as well on Wed, however we are still working hard on getting a good profile. We have some large BNC connectors, and they are hard to profile. We also have wave palettes, and these might be too thick
Electronics Forum | Fri Sep 22 05:33:59 EDT 2000 | Wolfgang Busko
That "C - it doesn�t matter" choice sounds good because it doesn�t give you a headache when profiling but it gives me a headache when I read the article in the current "newsletter" about profiling where I found this: "If soldering to gold over nick
Electronics Forum | Thu Apr 15 10:09:55 EDT 2010 | davef
Dross formation rates for SnCu and SAC are roughly 2.5 times the rate for SnPb (Hwang et al., 2004) Methods for reducing dross are: * Lower pot temperature * Run pump speed slower and only when soldering * Check solder contaminants to BS219, ASTM
Electronics Forum | Wed Nov 21 06:01:57 EST 2018 | premkumar_haribabu
Hi Davef, Thanks for your quick reply , just my inputs - we using 99.99 % pure nickel strip for soldeirng & when we do manual soldering this nickle stips its working well but when coming to SMT reflow even after high peak temperature ,its removes ev
Electronics Forum | Tue Dec 13 09:15:56 EST 2005 | Samir Nagaheenanajar
5% Bi results in less plasticity * Formation of low temperature (ternerary phases) not detected. I don't advocate the use of Bismuth, per se, but rather I'm just relaying info. that I learned this from a Lead-Free seminar that I attended at Riyadh
