Electronics Forum | Wed Dec 15 10:37:55 EST 2004 | gopinath A
Thanks Dave, That answers my question. I didn't think either that the qty of gold in platings would be enough to contaminate the solder pot. I wanted to make sure that leach test is a valid test for gold finishes. Gopinath@mcl.com
Electronics Forum | Mon Dec 06 16:54:38 EST 2004 | Gopinath A
Hi, I understand that solder dipping of gold plated units (PCB or component lead) is not the ideal solderability test (leaching of gold in the solder bath being one reason). Would anyone have recommendations as to the ideal solderability tests for g
Electronics Forum | Thu Sep 17 12:00:19 EDT 1998 | Mike C
| | I need an evaluation process to prove to a customer that our no-clean process does not leave excessive residue? Any ideas? | Wayne: More of the same as Chry and Justin. | KEY ISSUE | The first thing that you need to know is: What does your cus
Electronics Forum | Wed Oct 02 09:36:10 EDT 2002 | scottefiske
Dragon, Was recently responsible for No Clean Process/Material evaluation and implementation project. Shop was 100% Water soluble facility. Several Top Paste manufacturers were invited to participate. (3) were evaluated. All key variables were identi
Electronics Forum | Fri Jan 14 08:42:47 EST 2005 | Jim Zanolli
We are performing testing for lead free connector finishes. We want to run solderability tests on a series of lead free connector plating options in a series lead free PCB's. I need some advice on the most popular lead free PCB finishes. I am aware
Electronics Forum | Tue Dec 07 17:38:50 EST 2004 | davef
ANSI/J-STD-003 - Solderability Tests for Printed Boards is widely accepted. That's it, that's the list. If you email us your email address, we'll give you someone to call. Without knowing the number of boards that you plan to run across your wave,
Electronics Forum | Mon Jul 19 14:58:50 EDT 2004 | mattkehoe
We have a need for expert opinions on a solderability issue. Our company prints and then reflows solder paste with no components in place. It is then washed and flattened with a special flattening machine. Usually, the paste fuses and spreads out
Electronics Forum | Mon Jan 17 07:48:37 EST 2011 | davef
SMTnet Newsletter Aug 1999 by B Ellis Title: A Comprehensive Guide to the Design and Manufacture of Printed Board Assemblies Vol. 1 & 2 Editor: William Macleod Ross Publisher: Electrochemical Publications Limited, GB This two-volume work can p
Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
Electronics Forum | Wed Apr 01 11:35:24 EST 1998 | Big Manny
I've had some field reliability and Accelerated Life Test (ALT) issues with BGAs on Entek coated Cu. > The best results so far are with Atotech coated Gold electroplate finish. > Solderability, for factory process, seems to be as described by Justin
