Electronics Forum | Thu Feb 13 10:15:09 EST 2003 | dwanzek
Bridges are front to back. To me this seems to indicate thieves would pull the solder away from the pins. I feel I am correct in that theory. Yes, it would be a good idea for us to bring in a consultant but I have the opportunity right now to make b
Electronics Forum | Wed Feb 12 13:37:22 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
Electronics Forum | Wed Feb 12 12:06:58 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
Electronics Forum | Wed Feb 12 16:23:30 EST 2003 | russ
I agree with DDave, You have something else wrong! .100 dips with .05" lead protrusion should not bridge (in fact I would think that it would be almost impossible). Tell us about your machine, (laminar flow, A-wave, etc.., size of nozzle, wave heig
Electronics Forum | Thu Feb 13 10:38:51 EST 2003 | davef
Given that you are bridging front to back, contast the situation with the thiefs used to prevent bridging when wave soldering SOIC. If this is reasonable, the thiefs should be located behind the trailing connector pins. You can prove-out this [and
Electronics Forum | Thu Feb 13 07:13:39 EST 2003 | davef
Tell us more about the location of the bridging [ie, front-to-back, back-to-back, front-to-front, etc]. Thoughts are: * Your annular ring around the hole seems large. You have 0.007", consider 0.003" to be the minimum. Your board fabricator can gi
Electronics Forum | Wed Feb 12 13:45:15 EST 2003 | MA/NY DDave
Hi Good Luck, I worked a long time with THT components like you discuss and boards totally or partially populated. Dee Machines, Electroverts, Hollis and an other and never had the kind of problems you are listing stayed with us forever. I mean you
Electronics Forum | Wed Oct 07 17:36:48 EDT 1998 | Ted Nicholas
Hello! Does any one know of a disadvantage of using the Phillips recommended wave solder SOIC footprint where the last pad on each side of the SOIC is enlarged, instead of placing an extra pair of pads behind the SOIC. Both footprint patterns seem e
Electronics Forum | Wed Aug 24 11:48:37 EDT 2005 | Anthony
Hello, we are currently designing our first PCB with surface mount components on both sides of the board. I understand about solder thieves in order to help short circuits. Are there any good white papers or books which identify the best practices w
Electronics Forum | Fri Oct 18 09:50:02 EDT 2002 | russ
Steve, I am not aware of any standards so to speak. But IPC 782 and 770 have some useful info regarding mounting and pad geometries for wave etc... Since I do not know what type of components you will be wave soldering I will just give you some
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