Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef
You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1
Electronics Forum | Tue Aug 07 20:43:47 EDT 2001 | davef
First, we know that MIL types are wont to use charts like that. Give �em Weibull distribution tables and then they�ll be happy, happy. A good book is Nelson �Accelerated Testing: Statistical Models �� Wiley Second, we don�t use that very nice stu
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