Electronics Forum | Thu May 14 01:14:08 EDT 2015 | m_imtiaz
i want to know what is the ideal viscosity of solder paste before printing. i have brookfield viscosity meter with Spiral Spindle.
Electronics Forum | Thu May 14 08:22:27 EDT 2015 | m_imtiaz
in enclosed data sheet mentioned 230Pa.s with malcom viscosity meter i have brookfield viscocity meter kindly suggest
Electronics Forum | Thu May 14 08:17:00 EDT 2015 | emeto
I am pretty sure that will vary on the paste manufacturer. Using different amount and composition of flux will give you some different viscosity. I evaluated different solder paste brands before and I can tell you that some of them are very runny com
Electronics Forum | Thu Apr 20 00:53:23 EDT 2000 | Wister
Hi,Dave The "skip" wouldn't happened because we monitor the solder paste height every two hours.The open position is between chip terminal and the solder paste.one terminal lift a little not as same as tombstone.I suspect the activity of solder paste
Electronics Forum | Wed Jul 07 13:33:45 EDT 1999 | Dave F
| who can tell me how viscosity measurements are really effective in smt process control? what can I monitor? Is it depending from fine pitch size? | Thanks a lot. | g. d'andrea | People write books on SMT process control. What's your problem? I
Electronics Forum | Thu Apr 20 21:45:10 EDT 2000 | Dave F
Wister: Oooo, I understand now what you mean by "an open." Sorry, I was (am) a bit dense. Your hypothesis is reasonable. On the other hand, have you looked at the traditional causes of tomb stoning also? For a defect to be a "tomb stone," it doe
Electronics Forum | Thu Jun 06 15:55:28 EDT 2002 | arzu
I agree with the others and experienced the problem myself this week. Solderballs at the side of the chips. I looked at the board and found that the chip is pressing the paste away too much. This in combination with our quite big pads(and stencilaper
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Wed Apr 05 23:56:02 EDT 2000 | angela
Recently we have serious problem of our 0.5mm pitch QFP solder bridge. I check the viscosity of the Litton Kester paster. It's roumd about 700 is it too low. And do you have god solution about it? thanks alot
Electronics Forum | Fri Apr 27 10:33:58 EDT 2007 | ck_the_flip
Jeremy, well said! Thanks for "validating" my theory... LOL I agree that the sampling frequency, AND methodology are key things with 3D inspection. 3D will give you some insight onto how your paste (rheology, viscosity, thixotropy)AND process are
