Electronics Forum | Thu Mar 16 17:33:40 EDT 2017 | dontfeedphils
Voiding, fracturing, barrel-fill, I'm sure there are some I'm missing.
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
Electronics Forum | Tue Feb 21 11:59:56 EST 2006 | dannyleach
We design a broad range of DC/DC power supplies for various telecom, internet, and computor applications and have been succesfully using intrusive reflow for ~7 years now. Our pcbs range from 0.065 to 0.090 in thickness and are moslty dense 4 to 8 la
Electronics Forum | Wed Jul 06 15:26:12 EDT 2022 | glasscake
No experience with low temp solders for PIHR but we do use standard lead free 245-255 peak profiles on high temp connectors frequently. Honestly the added cost of the high temp connector pays for itself in labor. I almost always use oversized apertu
Electronics Forum | Wed Jul 06 15:29:01 EDT 2022 | glasscake
Also I should mention, I've ditched the formulas for getting the "optimal" solder amount after being bit by them once. Now I just design a PCB with 4-10 spots for the connector then order a stencil with a range of aperture sizes. Figure out what give
Electronics Forum | Mon Jun 12 10:34:06 EDT 2006 | cuculi54986@yahoo.com
My brother-in-law is a DDS and I trust him. We had some problems with solder voids in the past, and he was invaluable. He'd drill them out and fill them with SAC3240X+.
Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon
class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.
Electronics Forum | Wed Jun 29 12:31:32 EDT 2022 | proceng1
I don't know about that paste, but I can give my experience trying intrusive reflow (pin in paste). Using standard Lead-Free paste, we often had issues. It seems that many ROHS parts can't actually handle reflow ROHS temperatures. So the fact that
Electronics Forum | Tue Dec 30 09:31:52 EST 2014 | rgduval
I've always approached it like this: Design your processes and perform your work to class three standards, and inspect to the standard that is acceptable. That is, all work should be performed to the highest degree of quality. When the work is ins
Electronics Forum | Fri May 15 18:18:51 EDT 1998 | Earl Moon
| Help! | We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The
