Electronics Forum | Wed Feb 15 08:47:09 EST 2006 | pjc
Yes, doing the DoEs on your wave to achieve optimum settings that deliver the best results on your worst board is correct method. If not clear on the process, there are still wave solder process classes out there you can attend or hire in-house. If y
Electronics Forum | Tue Aug 30 10:48:18 EDT 2005 | cmiller
If you do not have a lot of TH joints there are some advantages. No boards "submarined" in solder pot on wave. You can solder the bottome side SMT parts rather than epoxy them when the parts are put down. This should reduce SMT defects and missing pa
Electronics Forum | Mon Aug 29 13:01:57 EDT 2005 | stalkerb
PR thankyou for your feedback, your comments are extremely helpful. We have a customer product porfolio of about 900 active products, covering approx 700 different fabs. your comments are absolutely valid with regards to Speed, however in our scena
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Feb 07 11:26:40 EST 2006 | Cal Kolokoy
At the wave, you should collect data on the critical process parameters. The cliche being, it's better to control your process via SPC versus performing SPC on defect data. Perform a DoE to determine which variable interactions have the greatest eff
Electronics Forum | Tue Aug 27 14:19:25 EDT 2019 | surfacemountprocess
They do perform well and are much easier to maintain than impeller driven pumps as there are no moving parts. The machines with electromagnetic pumps do cost more but the extra investment is worth it. One of the main benefits of the electromagnetic
Electronics Forum | Tue May 23 02:32:33 EDT 2017 | bukas
hello Zac, if you are running pump at 100% and there is not enough wave then you will probably need to empty solder bath and clean everything. also check pump parts for tear and wear. eached solder inlet can make a lot of problems when it comes to w
Electronics Forum | Fri Apr 06 11:37:19 EDT 2001 | raton
We had the same problem years ago when we started using a radial inserter. The inserter would dutyfully insert and clinch the leads. The problem in our case was the component body sealing to the fab, especially on electrolytics caps with a film jac
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
