Electronics Forum | Mon Jun 25 20:59:51 EDT 2001 | davef
As Wolfgang says: Conveyor speed may be too high. Excuse me for not stripping-out my repetition from your list, but other machine adjustments to consider are: * Using more efficient [higher specific gravity] flux. [Got it!!!] * Adjusting wave shape
Electronics Forum | Fri Mar 19 11:01:42 EST 1999 | Dave F
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Tue Dec 16 15:43:50 EST 2003 | patrickbruneel
Kev, I looked up records of various hollis machines with 3 preheat zones. and with progressive preheat temp. of 300 400 and 500 with a speed of 3.5ft/min the topside board temp was 120C before entering the wave. the preheat elements were infrared. W
Electronics Forum | Fri Jan 28 12:18:32 EST 2005 | Chunks
Your best bet is to do a decision making matrix. Each company has so many different criteria�s it's hard to pick out which one might be important to yours. Simply pick out your top 5 paste manufactures. Next decide what your "Eliminators" are - th
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Fri Feb 22 13:19:54 EST 2013 | caurbach
Our new Soltec Delta 3 has this feature (they call it mainwave pushup) where you can add up to 60 rpm to the pump after the leading edge passes over the wave. Unfortunately, our old Delta Wave doesn't have this feature. Ideally we'd like to set it
Electronics Forum | Fri Apr 05 18:22:18 EDT 2013 | Adam
We have two ZipaTec 460s Selective Solder Machines, one for Lead and one for Lead-Free. This morning we noticed the solder pot was covered in solder balls, and after asking the operator what they had run, the answer was "Nothing." The operator had al
Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly
Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a
.gif)
