Electronics Forum | Mon Jun 05 18:50:10 EDT 2017 | caurbach
Hi Zac, My 2 cents: We had similar problems on a board in the same situation (tin-lead HASL, very long leads, low pot height, high pump RPM). Trimming the leads shorter, moving the pot closer to the board, and dropping the pump speed down to sane
Electronics Forum | Thu Jul 17 20:20:12 EDT 2008 | davef
Wave set-up DOE * Immersion depth [1/3 to 2/3 of board thickness] has the least impact of any variable in wave soldering. * Contact length the greatest impact. * Control flux density, time through preheaters, top side temperature as the board reaches
Electronics Forum | Tue Aug 12 13:40:08 EDT 2008 | ck_the_flip
GR@ICS: Are you drag soldering or point-to-point soldering? Keep in mind. Drag soldering mimics wave soldering. Molten solder is contacting and dragging across the solder mask. Keep in mind, too, that "semi-matt" or "semi-gloss" will also tend to
Electronics Forum | Mon Jul 31 20:34:58 EDT 2017 | zsoden
Hi all, it has been a bit of a delay but I've finally had a chance to do some further investigation on this. First off, we spend some time to clean the solder bath using Kester Solder Saver and scooped out a lot of crap. We then added about 5kg of
Electronics Forum | Tue Feb 19 14:00:55 EST 2002 | global
We have had some discussions about what causes parts to lift out of the holes when going over the wave on our flow solder machine. The machine being used is a Treiber (700 series). There are two bottom pre-heaters and one top pre-heater. We try to pr
Electronics Forum | Thu Sep 08 06:19:55 EDT 2005 | lupo
Hello, Could anyone provide some support concern issue with vertical fill of through hole solder. Our lead free wave soldering process is not capable to fill 100% (requirement of our customer)through hole. We made everything (DoE) - different amoun
Electronics Forum | Fri Oct 14 08:12:48 EDT 2005 | lyrtech
For LUPO: speed: 4.5 inch alloy: 63Sn/37Pb Solder pot temperature: 500 Quantity of flux: just to wet the board
Electronics Forum | Tue Aug 31 08:10:38 EDT 1999 | Brian Conner
| I am building a board with T1/34 LED's in a 10X10 array there are 12 arrays in a panel. The LED's are body to body in the array, .1 spaced. The LEDS have been autoinserted on a Universal RAD III, so they are cut and clinched. The trouble I am havin
Electronics Forum | Fri Oct 14 09:21:36 EDT 2005 | lupo
According with temperature vs. wetting force diagram 245-250C/degrees is better, so lower temperature than 500F means better solder fill. If the speed is too lower the solder suck out form the hole. Usually 120-150cm/min. is good. (2-4s contact
Electronics Forum | Fri Oct 14 09:58:13 EDT 2005 | patrickbruneel
Here's what I believe is happening. The main difference between the HASL boards and the gold plated boards is that HASL boards are pre-soldered. HASL boards need very little flux activity to get good hole fill and the machine settings have a wide pro
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