Electronics Forum | Tue Jan 04 12:37:41 EST 2005 | Cmiller
We have been using this finish almost exclusively for fine pitch boards for about 5 years. Make SURE you use a board house that does the gold plating in-house. There are some potential issues as DaveF stated. The only problem we have encountered is w
Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef
The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E
Electronics Forum | Thu Dec 01 21:17:30 EST 2005 | davef
Does the solder melt when 'hit' with a soldering iron [and maybe a little flux]? If so, what is the appearance of the solder flow? What causes the green tint in the picture you provided?
Electronics Forum | Fri Dec 02 08:52:05 EST 2005 | pavel_murtishev
Good evening, I�ve just solved very similar soldering issue. In my case the problem was with 0603 chips. Solder joint had same appearance. I suspected that solder do not melted and increased TAL and peak temperature. No result. Next thing I tried to
Electronics Forum | Fri Dec 02 08:10:25 EST 2005 | Amol Kane
Davef and russ, thank you for your input The kester was selected due to a management decision, I shall recommend that other solder be tried out as well. davef, i'll try out the soldering iron......and also look for the green tint (didnt notice that
Electronics Forum | Thu Dec 01 14:24:25 EST 2005 | Amol Kane
Hi, I am having a SAC 305 solder paste with water soluble flux wetting issue. during reflow, the solder melts, but doesnt flow. the reflow profile was developed by the solder company person (Kester). the board is a test assembly to validate our LF pr
Electronics Forum | Thu Dec 01 17:24:37 EST 2005 | slthomas
Are you sure you're getting enough paste on the pads? It looks like you may not have enough flux to get the solder to wet properly.
Electronics Forum | Tue Apr 17 21:19:31 EDT 2001 | davef
Curious. Tell us more about: * Murata solderability protection * Solderability protection on the caps used to replace the Muratas * Reflow profile used with each of the two pastes * Differences in the two pastes
Electronics Forum | Thu Dec 01 14:41:06 EST 2005 | Bill C
It looks to me that your reflow profile is not hot enough. Seeing the granular structure of the solder paste still on the board would indicate the paste has not reflowed entirely.
Electronics Forum | Thu Dec 01 14:42:57 EST 2005 | Amol Kane
my first thought was that too, but all the other components on tha board have reflowed properly. I have tow test boards, one with Imm Sn and other with Imm AG. on both these boards only the QFP has this solder phenemenon
