Electronics Forum | Wed Feb 09 19:55:27 EST 2000 | Russ
Hello All! I have a problem that hopefully someone out there might have some ideas. I have an assembly that upon the "dental pick test" the entire solder fillet is coming up with the lead and leaving what appears to be a bare pad. I believe that th
Electronics Forum | Fri Feb 11 18:09:11 EST 2000 | Glenn Robertson
Russ - I agree with the other guys that the problem could be black pad or some intermetallic problem, possibly related to the "conversion" to HASL finish. But my first guess is still partial reflow at wave soldering. You won't catch it by push
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef
Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior
Electronics Forum | Thu Nov 14 09:24:07 EST 2002 | joconnell
What about when debugging the board I recently saw a case where we damaged a board between - 5-10 cycles of the fixture It's a catch 22 - where you need high force probes to breal the OSP - but the copper is hard surface, not like the solder HASL a
Electronics Forum | Fri Nov 15 15:02:37 EST 2002 | MA/NY DDave
OK I know it is funny to have two different PWB/PCB processes, one for pre production and one post production yet it is possible if controlled and implemented in a strategy. In debug if your company's experience has been for a repeated need to do IC
Electronics Forum | Mon Jan 23 20:58:08 EST 2006 | davef
J-STD-003B - Solderability Tests for Printed Boards is currently a "Working Draft". Look here: http://www.ipc.org/status.asp
Electronics Forum | Mon Jan 23 03:12:13 EST 2006 | adeline_ko
The FA department is using IPC or J-STD-003 to do the solderability test for the leaded PCB FA qualification. Class A. However, there is no mention of Lead free testing for the PCB bare brd. Can anyone advise whether IPC has release a solderability
Electronics Forum | Fri Aug 13 17:45:43 EDT 2010 | bradlanger
Boards with the LF hasl finish applied too thin will genrally pass the IPC test. That is some pretty agressive flux they call out. The boards usually wave solder just fine as well. Reflow is where the you see the problem.
Electronics Forum | Mon Nov 10 12:29:59 EST 2008 | joeherz
Dave, You've got me worried - All of the boards we've tested to this point are LF HASL. Why do you say "can't be ENIG"? Am I missing something? We have not sectioned soldered boards as yet but plan to shortly. Thanks.
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