Electronics Forum | Tue Jun 04 10:39:54 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Feb 08 03:55:18 EST 2005 | Rob.
We got ours hooked on solderballs - 2 birds with one stone!
Electronics Forum | Mon Oct 27 14:28:19 EDT 2008 | patrickbruneel
Do you refer to the highlight in the picture as a solderball? Looks more like copper to me.
Electronics Forum | Tue Jun 15 13:36:30 EDT 2004 | John S
We are launching a new product and are fairly new to reflow soldering. A concern that has arisen is a fairly consistent solder ball that forms at an electrolytic capacitor. We changed to a homebase aperture design on our passives to eliminate mid-c
Electronics Forum | Mon Sep 20 16:27:58 EDT 2004 | blnorman
Besides the processing tests (different print speeds, print delay times, etc.) one test we've had to use is humidity exposure. Solderballing due to high outside humidity is a problem in our plant. So we expose paste to 85% humidity for various time
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
Electronics Forum | Sat Feb 20 09:56:22 EST 1999 | Tufty
| We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not b
Electronics Forum | Tue Apr 28 19:20:53 EDT 1998 | Steve Gregory
| We want to produce BGA�s which will be see burn in conditions | of 140�C / 24h active tested. | Now we think about problems for the solderball uniformity. | Does anybody know about problems or about special solderball | alloys for such productscon
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Tue Mar 22 20:33:24 EST 2005 | davef
Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides. Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA
