Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Electronics Forum | Tue Aug 22 10:57:48 EDT 2000 | caumel
Hi folk's With some pcb's after wave soldering ,we find some solder blobs on vias. There seems to be air inside these blobs What can we check in order to solve this problem? Thanks in advance
Electronics Forum | Thu Jul 20 14:20:17 EDT 2000 | Bob Willis
In real terms the temperature compatibility is the real issue. Yes a component can and in most case will cover the paste. The component standoffs must prevent the body contacting the paste to prevent solderballing. Bob Just back from dinner, my mum
Electronics Forum | Fri Feb 05 09:47:54 EST 1999 | Dave F
| Name of equipment that automatically does the solderballing. Pads are .010" on .050" pitch | Rich: Try Flux free: Scientific Sealing Technology 562.803.3361 Flux: Vanguard 800.524.7897
Electronics Forum | Thu May 01 18:01:38 EDT 2003 | jym2000
Just take care about reflow profile with this kind of product, you can get a bad-formation in your PCB (Flexcable or your flexcircuit) however you want to call... This bad-formations looks like a solderballs (Microscopio) Regards Jesus
Electronics Forum | Thu Jul 15 15:37:29 EDT 2004 | davef
Get started by searching the fine SMTnet Archives. We love talking about tombstoning and solderballs. Good luck.
Electronics Forum | Fri Mar 18 10:51:25 EST 2005 | russ
Are we talking about reflowing the two boards together after the one gets the solderballs reflowed onto it?
Electronics Forum | Sun Mar 26 13:17:06 EST 2006 | ausajid
hi thank you very much for swift reply and help in reduction of subjected problem. i will study and explore that site and confirm the results. many thanks
Electronics Forum | Wed May 03 16:42:16 EDT 2006 | Silver Sparrow
We run both No-Clean and Water Soluble boards without any problems. We had problems with solderballs, but adjusted the P&P machines not to push the parts into the paste so much. Home plate apperatures help also. The biggest question is if your cus
Electronics Forum | Wed Aug 16 13:31:30 EDT 2006 | a_laser
You can stop cleaning after a job when there is no more paste in the apertures. Under wiping should be done with a quality cloth and should leave no paste on the underside of the stencil (assures good contact on the next print and reduces chances of
