Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Thu Nov 14 05:45:51 EST 2002 | Jon O'Connell
Has anyone had experiences of ICT test fixtures actually damaging the PCB boards - typically when they have moved away from HASL finish to OSP. I would also like to hear more about any specific issues seen at ICT for non HASL pcb finishes thanks -
Electronics Forum | Thu Nov 14 09:24:07 EST 2002 | joconnell
What about when debugging the board I recently saw a case where we damaged a board between - 5-10 cycles of the fixture It's a catch 22 - where you need high force probes to breal the OSP - but the copper is hard surface, not like the solder HASL a
Electronics Forum | Fri Nov 15 15:02:37 EST 2002 | MA/NY DDave
OK I know it is funny to have two different PWB/PCB processes, one for pre production and one post production yet it is possible if controlled and implemented in a strategy. In debug if your company's experience has been for a repeated need to do IC
Electronics Forum | Thu Dec 12 10:00:44 EST 2019 | alexeyzb
Hello! 1) You can try to use solderbility tester (https://www.gen3systems.com/solderability-testing-must). 2) You can try to find more agressive solder paste. Some time ago we had the same problem. We gave some samples to our friends from another co
Electronics Forum | Thu May 16 22:37:22 EDT 2002 | xzinxzin
anyone experience to solve the non-wetting on Microleadframe packages component terminal sides. 1)I test the components solderbility in dip and look test, in solder pot at 240 deg C,the wetting on the sides is ok. but I run on mass production in refl
Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean
Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b
Electronics Forum | Fri Sep 08 09:16:37 EDT 2006 | james
We are incurring problems with Film Chip Capacitors with reflow issues. Some of the parts are misaligning or not soldering on one end (almost tombstoning) . We left the parts in the dry cabinet till they were used. We tried both reflow ovens (hell
Electronics Forum | Mon Sep 09 08:21:37 EDT 2002 | mk
What kind of changes could be expected by changing from a HASL finish to gold? We have a board the had been being coated with HASL but was changed to gold to make priting easier. Now, even though the soldering looks fine, we are getting fallouts at G
Electronics Forum | Wed Sep 11 15:49:10 EDT 2002 | stepheno
Are you no clean or WS? Have you used a MultiMeter to verify the ICT failures? Maybe the components are fine but the pins are contaminated. Or the test points. Don't have any reason to suspect that due to HASL vs gold. It's just I don't trust data o
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