Electronics Forum | Tue Feb 20 13:10:54 EST 2001 | billschreiber
Hello Dave, Before I get into waste management, I must first stress the importance of checking with your local regulating agencies. Every area can be and usually is different. California regulations differ from Ohio and Ohio�s are different than Mu
Electronics Forum | Wed Jun 30 22:00:29 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, b
Electronics Forum | Thu Jul 01 16:52:31 EDT 1999 | JohnW
| | | | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a
Electronics Forum | Thu Jul 01 17:12:28 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with
Electronics Forum | Wed Sep 22 22:18:37 EDT 1999 | Dave F
| I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn/Pb)
Electronics Forum | Fri Aug 13 08:14:38 EDT 1999 | Peter Barton
| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous
Electronics Forum | Tue Jul 27 17:54:37 EDT 1999 | Earl Moon
| | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | 12BGA per assembly | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | Pads .014inch | | | | | Vias within footprint .020inch | | | | | Vias to
Electronics Forum | Thu Jul 29 11:34:27 EDT 1999 | Justin Medernach
| | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | 12BGA per assembly | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | Pads .014inch | | | | | | Vias within footprint .020inch | | |
Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon
| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02
Electronics Forum | Sat Jul 10 02:47:27 EDT 1999 | Scott
| | | Hi! | | | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board
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