Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
Electronics Forum | Fri Sep 11 15:27:50 EDT 2015 | u4bga
Hi! We're noticing white spots on 2 PCBAs after the selective soldering & DI Wash processes. ----Facts---- 1) The marking is on all boards, irrespective of date code 2) It only happens on leads that have been selective soldered 3) The pattern of w
Electronics Forum | Tue Nov 19 21:38:39 EST 2019 | zack
Hello, The first thing that you need to do is to make process mapping about this incident, so you can exactly determine all factors and observable changes happened during 2 weeks of timeline difference. According to my experience, if all equipment
Electronics Forum | Fri Feb 23 09:35:36 EST 2024 | emanuel
We have the standard profile as a template made according to the solder paste specs. For some boards we measure the result at 2 points, on the board itself and on top of a sensitive SOT263 module and adjust accordingly. The solder paste is well kept,
Electronics Forum | Mon Sep 11 04:10:46 EDT 2000 | Jim Arnold
I spent 25 years operating my own hybrid shop working with surface mount components, soldering materials and procedures. Dealing all the while with it's associated surprises and problems such as yours. Now-a-days I get paid to investigate and attemp
Electronics Forum | Wed Apr 12 22:26:08 EDT 2000 | Alberto Hern�ndez
Hi Kevin!!! I have worked with both sides boards in 3 differents ways: a)Glue-Solder paste- Manual assembly- Wave soldering For the bottom side we placed glue dot in the board then we placed parts and finally the convection reflow at 150�C each zone
Electronics Forum | Thu Sep 09 10:09:15 EDT 1999 | John Thorup
| | | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be don
Electronics Forum | Tue Aug 17 09:59:50 EDT 1999 | Earl Moon
I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the adve
Electronics Forum | Fri Jun 04 15:04:16 EDT 1999 | Earl Moon
| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The
Electronics Forum | Thu Jul 22 22:18:12 EDT 2004 | davef
Notes from an AIM No-Lead Presentation ... Wave Soldering * May require a higher pot temperature than tin/lead: 255-265*C * May require a change in liquid fluxes to compensate for the poor wetting of some alloys and high thermal stresses of the wave
