Electronics Forum | Wed Mar 19 19:02:39 EST 2003 | Jodi Roepsch
From my experience, we have had little success in reworking boards with the black pad condition. In one instance, with several reworks, we were able to get plated through holes with the defect to take solder but the joint reliability was highly ques
Electronics Forum | Fri Feb 21 10:31:48 EST 2003 | adlsmt
We dont have the debridging knife. I had one on an old Hollis machine I had once. It was totally worthless. I am setting up the nitrogen today. I will let you know how its goes. We are using a water based no-clean. The nitrogen will probably make a
Electronics Forum | Tue Feb 25 15:29:46 EST 2003 | MA/NY DDave
Hi Locktite is telling you to cure first, maybe for a good reason. So the epoxy becomes stable just before solder reflow moves stuff around and around and then settles. A WEG yet if you did some cross sections and analysis you might find piles of
Electronics Forum | Tue Feb 25 23:17:12 EST 2003 | MA/NY DDave
Hi Up above in his operation / process description after a call to Locktite and then my note and then your note, we may have found the problem. One never knows at a distance. It appears he is striving to do soldering/reflow first and then concurren
Electronics Forum | Fri Feb 21 19:41:25 EST 2003 | neil
I have had a look at what Bob Willis say's and the answer to my problem is not there. The paste we are using has a very high viscosity and I beleive that if we reduce the metal content to less than 90% it will solve the problem. The problem is parti
Electronics Forum | Wed Feb 26 16:06:34 EST 2003 | slthomas
Something else I just thought of, and MikeK touched on it briefly, is what you'll be cleaning. If you need to be capable of removing both epoxy and solder paste, for instance, you need to look at chemistry and processes that will clean both, and the
Electronics Forum | Mon Mar 03 11:12:49 EST 2003 | MA/NY DDave
Hi I have seen a few different ways to do this, including hand solder for certain PIH (pin in hole) components as the last operation. Search the archives would be one place for you to look Buy or Borrow one of the SMT Books out in the market. Ther
Electronics Forum | Tue Mar 11 10:13:15 EST 2003 | genny
Some people have said that for smaller components like 0402, a 2% silver paste (62/36/2)has helped reduce the tombstones. The reasoning is that this paste has a longer plastic zone compared to a true eutectic solder, and if there is any uneven heati
Electronics Forum | Thu Mar 27 14:38:44 EST 2003 | MA/NY DDave
Hi kenlchin, Yes, This all helps with these little components that can be affected by the forces created during soldering more so, than their own stabilizing weight. On this tread which started with a composition only proposition, we have seen tha
Electronics Forum | Sun Mar 23 13:39:39 EST 2003 | MA/NY DDave
Hi, From re reading, I think I did OK with my previous message yet I wanted to hit some other items, maybe differently. Without checking all the sources I don't believe there are any industry wide standards. I am sure and know there are industry