Electronics Forum | Sun Jul 26 20:54:40 EDT 1998 | Masdi Muhammad
Hi, Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subjecte
Electronics Forum | Mon Jul 27 13:54:25 EDT 1998 | Ted
| | | | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For
Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon
| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B
Electronics Forum | Sun Jun 14 03:58:40 EDT 1998 | Arul vanan
Does any one wave solder the 0402 Chips on the bottom side of a board? Any comments?
Electronics Forum | Thu May 21 22:07:47 EDT 1998 | Mike Konrad
I am a former employee of a drag soldering machine manufacturer. For years they attempted to devise a method of soldering surface mount devices via the drag soldering machine. Bridging was the largest problem along with component damage due to exce
Electronics Forum | Fri May 22 22:13:27 EDT 1998 | G. Henning
Thanks for the advice. We are experiencing only limited success with SMT on the drag. Problems are indeed bridging and misses on the smaller discretes. Works well on PTH as long as the pitch is not too tight. I'll have to justify a new machine. Rega
Electronics Forum | Sat Apr 04 16:34:47 EST 1998 | Peter Van der Zee
Can anyone help with advice on the possibility of "rejuvinating" aged solder paste for SMT applications. Thanks!
Electronics Forum | Tue Dec 23 07:38:35 EST 1997 | raymond
how to determine the optimum solder paste height ?
Electronics Forum | Wed Aug 15 16:09:59 EDT 2001 | monkey
Good fillet at the heel is most critical. Check out IPC standards for acceptable solder joints.
Electronics Forum | Mon Sep 17 10:05:48 EDT 2001 | sallyt
From your experience, what are the properties of a solder paste that will achieve a high yield 0201 assembly process?
