Electronics Forum | Tue Dec 11 08:58:31 EST 2001 | zanolli
Go to http://www.tekais.com and then to the the "Self Soldering Connectors"
Electronics Forum | Wed Jan 02 22:05:05 EST 2002 | visionlight
What are the implication of using lead free components on lead content solder paste.
Electronics Forum | Tue Jan 29 20:13:30 EST 2002 | davef
Over-time lead separates from the tin in solder by force of nature [diffusion], but I assume that is not what you are talking about. Please help us understand your question better. Are you saying that the solder does not attach properly to the comp
Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -
Electronics Forum | Mon Mar 25 13:48:52 EST 2002 | bcceng
We are currently applying solder bumps to hundreds of BCC's for rework. It is impossible to print to the PWB. It is recommended to apply solder bumps to the BCC's with 63/37 alloy making the rework faster and easier. Applying the solder bump on the
Electronics Forum | Mon Apr 15 21:08:35 EDT 2002 | davef
Search the fine SMTnet Archives to get started, until the Solder Ball Troops arrive.
Electronics Forum | Tue May 28 11:34:51 EDT 2002 | bphilips
What types of solder pre-forms are used on connectors?
Electronics Forum | Wed Jul 31 17:35:16 EDT 2002 | davef
* Finally, when soldered by hand, do the problem pads take solder? Yes, the XRF analysis will be interesting.
Electronics Forum | Fri Sep 13 18:01:18 EDT 2002 | dbonilla
Do you know what will be the best solder process for pins at the edge of the ceramic substrate? Thanks
Electronics Forum | Fri Sep 13 18:01:39 EDT 2002 | dbonilla
Do you know what will be the best solder process for pins at the edge of the ceramic substrate? Thanks
