Electronics Forum | Mon Oct 09 15:53:49 EDT 2006 | russ
We like to use the type thast solders onto board and only the top of it is snapped on, this way we can use equipment to place shield and remove shield when required for access to component. We also utilize a through hole shield but basically solder
Electronics Forum | Mon Oct 09 15:57:10 EDT 2006 | russ
We like to use the type thast solders onto board and only the top of it is snapped on, this way we can use equipment to place shield and remove shield when required for access to component. We also utilize a through hole shield but basically solder
Electronics Forum | Sun Oct 29 22:47:03 EST 2006 | LMPH
We are going to start doing rework of Lead Free BGA's. Have always used flux for SN/Pb boards/BGA's with good results. Can flux be used fro lead free as well? Boards were originally assembled using lead free paste and components. Hence, the BGA w
Electronics Forum | Wed Nov 01 08:55:05 EST 2006 | russ
See if the solder is leaving the pad(s) and is wicking up the component. This is long shot but I have seen something similar to this possibly in a wave process. We had a very thin board and a very large QFP on top. During wave operation the solder
Electronics Forum | Fri Nov 03 13:48:39 EST 2006 | monty
I have a BTU Reflow 8 stage (PCDIU software) oven. The max temp. that it will allow is 270 degrees. I am trying to use a High Temp solder paste and the profile states that I must go between 260 and 270 degrees. My question is, is there a way to incre
Electronics Forum | Fri Nov 17 17:34:26 EST 2006 | realchunks
OK, why are you hand fluxing? You may want to take the time to use your real fluxer. Yeah, it's a bit messy but you can control the amount of flux you're putting on the board. And with water based fluxes, this is critical. If you are stuck to han
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders
Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.
Electronics Forum | Sat Dec 09 12:19:28 EST 2006 | patrickbruneel
To all Techneters, Here�s a last chance to support the exempt request for lead in solders, Link to the publication and supporting documentation: http://tinyurl.com/y3p2dc Follow link below to support the exempt, John (RoHSUSA) made it very simpl
Electronics Forum | Sun Dec 17 08:41:38 EST 2006 | davef
Paul We've seen "cold welding" of solder paste when dispensed improperly. It occurs in the narrow confinds of the nozzle when someone tries to pipe too much paste, too quickly. The friction of all those little solder balls and paste juice fighting
