Electronics Forum | Tue Sep 01 11:05:36 EDT 2009 | saisungold
We gold plated PCB and while soldering, the adhesion of soldering is not uniform at the tips(soldering ends). Please help us to solve the problem.
Electronics Forum | Tue Sep 01 20:43:06 EDT 2009 | davef
Please explain "adhesion of soldering is not uniform at the tips (soldering ends)." For example: * Is the "tips (soldering ends)" the component leads? * What is the component? * What is the finish on the component? * What process is causing this issu
Electronics Forum | Thu Sep 10 15:06:11 EDT 2009 | dyoungquist
My guess is that he is talking about the gold plated pads not fully wetting with solder. We have seen this on some of our ENIG boards with the gold still showing at the far corners of the rectangular pads. Not knowing if this is hand soldering or p
Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae
Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re
Electronics Forum | Wed Apr 13 12:10:47 EDT 2022 | winston_one
Hello! We have a strange effect. Some pads of big trough-hole DDR slot just dessapear. Initialy it was soldered with selective soldering process (leaded, 290 degrees, ImSn finish, very short storage). Then some connectors with poor barrel fill we hav
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