Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Thu Nov 03 14:23:58 EST 2005 | Samir Nagheenanajar
Thank you for the advice. I am not so concerned with the "2nd reflow", as the same can be said for double sided reflowed PCBA's (the bottom-side parts essentially go through a 2nd reflow). As for the HASL, there is a formula in calculating how much
Electronics Forum | Wed Nov 23 17:50:40 EST 2005 | adlsmt
I am not aware of any such info so you may not get any replys on this but each of these systems is totally different. There is usually not much overlap of what is the right choice for an application. The solder bath machines with fixtures are for hig
Electronics Forum | Thu Jan 05 15:42:26 EST 2006 | samir
Grant, The strength of the joint in a CCGA is the column for one...it's more ductile, made out of 90% Pb, and it's meant to compensate for the massive CTE mismatches between the ceramic and the board (ie the columns flex to relieve stress from the e
Electronics Forum | Fri Jan 20 11:35:34 EST 2006 | Mike Dolbow Atotalgps.com
From what I have seen some component terminal finished have a problem due to storage also. I have seen pure nickel finished turn black. I have seen silver barring finished have problems too. It all depends on how you chose your process, PCB plating,
Electronics Forum | Thu Dec 15 02:09:22 EST 2005 | tk380514
SNAGGLETOOTH HOLDS HIS HANDS UP, HAVING JUST REACHED THE EDGE OF HIS OWN IGNORNACE. I just read up on black pads - http://www.emsnow.com/npps/story.cfm?ID=9784 when i checked the joints under the microscope they were a light grey slightly discolou
Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Wed Jan 11 13:08:19 EST 2006 | GS
About SACX307 for wave you can read at post: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=38727 As I have heard, in Europe, Germany in particular, several assemblers are using SN100C for wave (also HASL) with success since years ago.
Electronics Forum | Thu Jan 12 13:21:11 EST 2006 | barryg
Opinions. I have a large finned heatsink that we place over a D2pak transistor. This heatsink is designed to heatsink the transistor through the junction of the pad area that the transistor is attached to. The paste pattern we chose was small dots ar
Electronics Forum | Mon Jan 30 06:29:51 EST 2006 | slaine
we shouldnt be talking about lead free we should be talking in terms of RoHS compliant. HMP solder is exempt in the directive even though it has a hig lead content (93.5%) as no other alloy will melt at the same temperatures 298. as HMP is exempt wi
BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
Equipment Dealer / Broker / Auctions
13227 Royal George Avenue
Odessa, FL USA
Phone: 813-992-2437
