Electronics Forum | Tue Jul 24 10:23:36 EDT 2007 | ck_the_flip
Michelle, Traditionally, the adhesive side is always run first since most designers put passives (resistors, caps) on the adhesive (solder side) of the board. I worked in an environment where we did the adhesive side first, sometimes the boards "sa
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Sun Aug 19 15:34:20 EDT 2007 | davef
What are you trying to do: * Improve hole fill? * Reduce PTH voiding? Hole fill: Search the fine SMTnet Archives for stuff like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=36063 PTH voiding: Ideally, there are no voids. We're unawar
Electronics Forum | Thu Aug 23 08:31:09 EDT 2007 | ck_the_flip
Dave, that's good thread, but I think Mike is more concerned with the Titanium inserts that pallet manufacturers often use to overcome sh*tty designs - like the ones where they put a Through-hole 2mm away from a SMT pad. He's not so concerned about t
Electronics Forum | Tue Sep 04 10:27:33 EDT 2007 | rgduval
I haven't experienced this problem, exactly, but I have had issues with noise in digital circuits that appear to have gone away with touch up. The problem was that the customer blamed the noise issue on the solder quality, and he pointed to the fact
Electronics Forum | Wed Sep 05 10:59:02 EDT 2007 | slthomas
What's sad is, it really happened. I won't bore you with the details again. ;) Lloyd, I would love to have a nice Hi Scope too (I think Cchunks works for one of those big champagne and caviar corporate entities ;)) but if you can't swing it, at leas
Electronics Forum | Tue Nov 13 09:36:18 EST 2007 | rgduval
From a manufacturing standpoint, this isn't very nice. Vias will tend to wick solder away from the pad, resulting in insuficient solder joints, which require touch-up. The amount of times any solder joint is reheated should be minimized, as extra h
Electronics Forum | Wed Dec 05 22:59:42 EST 2007 | er_pe
To be successful, and to yield quality products off any selective solder systems out there on the market today, DFX rules need to be enforced and followed. Lay-out is a one-shot process where as manufacturing of the PCBA is continuous. Obviously, muc
Electronics Forum | Tue Jan 15 12:37:17 EST 2008 | gregoryyork
SORRY I did not offer a solution so here goes - The best way to get rid of this issue if you cant change flux is to reduce your flux consumption to a minimal with a spray flux and keep the heat REALLY high to boil off the alcohol before it can be abs
Electronics Forum | Thu Feb 14 23:37:38 EST 2008 | operator
That is bizarre. I would have to say that you need to do a test on the PCB to test solderability with an iron like mentioned before. If you don't find that the pads are contaminated or masked over lightly and the pads do take solder effortlessly, you
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