Electronics Forum | Thu Aug 05 08:39:26 EDT 1999 | Wayne Sanita
| | | Hello, If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but after c
Electronics Forum | Wed Mar 24 10:28:51 EDT 2010 | Sean
Hi all, Anyone used to come across solder void underneath mosfet as shown in the attached file? Will this pose any reliability issue, such as get burnt during functional test? How to over come this problem? As far as I know there is no acceptabl
Electronics Forum | Wed Jul 12 08:57:58 EDT 2006 | Evamaria
Mike , Look at http://www.circuittechctr.com, Guidebook, section 6,6.1. This method of attaching jumper wires is in accordance to the acceptability criteria of IPC-A-610 section 11.2.4.3. You did not specify what wire AWG is. I am assuming it is sma
Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman
Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems
Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane
I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of
Electronics Forum | Tue Mar 17 07:32:10 EDT 2009 | davef
Solder ball acceptance: IPC-A-610, 6.5.3.1 & 12.4.10. Solder balls: 5 ball system: * No more than 5 balls per square inch (100mm2) allowed * Solder balls can not be greater than 5 mil (0.005in) (100um) * Solder balls cannot be less than 5 mil (100um)
Electronics Forum | Fri Oct 23 15:43:31 EDT 2009 | seankim10
According to 5.2.6.1, it states that defected if Solder balls are not entrapped in no-clean residue or conformal coating. How do you define entrapment or how do you assess if the balls won't dislodge under normal product service environment? The sold
Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Wed Jul 22 12:47:23 EDT 1998 | Earl Moon
| I'm trying to put together a set of design guides for use for new designers | in house or to be sent out for contracted layout work. I would like to start with a top ten list of things that will go wrong if rules aren't available. For example testp
Electronics Forum | Sun Jul 29 09:17:20 EDT 2001 | davef
Tough to say, but ... Chlorine: Many fluxes contain chlorine. Sulphur: Many solders and paper packing materials contain sulphur. Sodium: No idea. IPC-J-001 talks to board cleanliness and specifies criteria according to the cleanliness test met
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