Electronics Forum: soldering and iron and requirement (Page 3 of 13)

ultra low cost pick and place?

Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap

I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe

Soldering robot and solder balls

Electronics Forum | Thu Jul 06 03:43:22 EDT 2017 | jamesbarnhart

Electronic devices required higher speed, I/O capability, and density to meet standard requirements. Automated robotic soldering solutions that meet the demands of applications are too challenging for hand soldering. Manual soldering, even with the m

Solder Paste and Stencil questions

Electronics Forum | Tue Oct 12 11:47:51 EDT 1999 | Jose RG

Hi, We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? 2- Is anybody using step stenc

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 12:49:47 EDT 1999 | Tony

| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing

PB-Free HASL and Leaded Solder

Electronics Forum | Thu May 13 16:55:51 EDT 2021 | emeto

With Pb-Free HASL you can't use Pb process for sure as the melting point of tin is so much higher than the lead paste process. SAC305 is the most popular compound, unless your assembly requires something else for a specific reason.

J-STD-002 and -003 solderability testing...

Electronics Forum | Fri Jun 29 14:15:00 EDT 2001 | stefo

This is a question about complying with J-STD-001 solderability testing. Do any of you have your vendors certify that the components and PCB's that you buy from them comply with the solderabilty requirements spelled out in the -002 and -003, in lieu

Wave Cassettes and Heat convection

Electronics Forum | Mon Jan 15 11:41:56 EST 2007 | davef

Questions are: * Does the component take solder when you dip it in the solder pot to test the solderability of the leads? * Can you get full barrel fill when wave soldering a bare board? * Is your flux reaching the top of the board through the hole b

RTS (Ramp-to-Spike) and RSS (Ramp-soak-spike)

Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam

we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How

IPC-A-610 and IPC J-STD-001 Updations

Electronics Forum | Mon Jul 24 09:15:32 EDT 2017 | davef

James: This is not "breaking news." IPC-A-610F, Acceptability of Electronic Assemblies was released in July 2014. Both, ... * IPC-A-610G, Acceptability of Electronic Assemblies * J-STD-001G, Requirements for Soldered Electrical and Electronic Assem

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:58:03 EST 2000 | Dave F

Robert: On your balls: Solder suppliers make several "standard balls" and can advise you. On your cleaner: Recycling water / direct to drain? Most batch cleaner suppliers can advise you on recycling and filtering systems to keep you out of troub


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