Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Thu Sep 20 20:07:24 EDT 2007 | davef
As sources for heat resistant gloves, try: * National Safety Apparel * Radnor
Electronics Forum | Tue Jul 19 11:52:24 EDT 2016 | oleksz
Thank you Pavel. Aleksander
Electronics Forum | Fri Sep 06 14:07:20 EDT 2002 | ppwlee
Thanks for all replying to my printing SPC posting. I like to expand the SPC discussion on reflow and wave soldering. I am aware of the common methods of applying periodic measurements using test vehicles though the machines to collect critical pr
Electronics Forum | Tue Dec 03 11:59:01 EST 2002 | slthomas
We haven't run a profile yet....probably because we're a-feared to. We can't do topside preheating here to any degree because we use an aluminum plate for aligning hundreds of top side through-hole components (pots, switches, buttons, LEDs) that te
Electronics Forum | Thu Sep 20 12:37:10 EDT 2007 | hussman
As long as your operator is grounded, a pair of welders gloves is fine. The leather kind do not build up static and do last a while. If the same pair of gloves is being used for dedrossing the wave, pay special attention to loose fitting gloves. I
Electronics Forum | Tue Dec 10 14:10:38 EST 2002 | Randy Villeneuve
Steve, I wave solder most if not all our boards with selective wave pallets. I did not catch if the solder balls were on top of the board or on the bottom but that will make a difference on what to do to get rid of them. Pallets are good and bad. On
Electronics Forum | Thu Dec 05 11:04:27 EST 2002 | slthomas
They're IR, bottom side only. Frankly wave solder is not my forte (there are those that would claim nothing is), but I've personally been tasked with developing a process to do reliable, high volume bottom side SMT, so I'm drawing a lot from the tec
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
