Electronics Forum | Wed Jun 23 08:47:32 EDT 2010 | mun4o
Hi, about location - components are in the diferent location on PCB.In the one PCB have 7 cap 560pF 0603 , and some of thenm are cracked, another are OK. When I look at 20x microscope , I can't see defect, but ICT measure from 200 to 350pf.When hea
Electronics Forum | Thu Nov 03 00:14:11 EDT 2022 | bin4ry2
Can anyone help to identify this little tan/brown colored pcb part? (The one labeled GND) I believe it's called an SMD ceramic capacitor but could certainly be incorrect. There don't appear to be any marking on it so beside the tan color, picture qu
Electronics Forum | Mon Jul 23 10:56:38 EDT 2018 | dleeper
I've never seen this before and I would be suspicious. Have you tried to dust it off with a brush or Q-tip, it might just be some sort of process contamination. Have you looked at the reel to see if the parts are coming in with these spots from the
Electronics Forum | Mon Jul 12 00:23:02 EDT 2010 | leadthree
I had cracking caps from the ICT and a variation in the length of the probes (due to wear and tear) that press down the PCB. That put lots of mechanical stress on the PCB. So have also a close look at the ICT, or another other test fixtures you use.
Electronics Forum | Fri Jun 20 10:27:19 EDT 2003 | Cristiano Dick Smiderle
Hi We are experiencing serious problem with ceramic capacitors. They are with low electrical resistence and the problem is intermittent. We found some of them with micro cracks but not all. What could be the causes for this problem? We are su
Electronics Forum | Fri Apr 18 16:53:25 EDT 2003 | takfire
DST, What was the crack signature? Was the crack parallel with the internal electrodes or 45� with the terminal electrode? It is also important to determine the orientation of the failed caps on the PCB (in regards to depaneling). Perhaps the cap
Electronics Forum | Wed Jul 02 18:39:22 EDT 2003 | Jim Yutzie
The vast majority of issues I have seen are from depaneling with a PCB seperator. Try placing a row of tightly spaced unplated holes adjacent to the edge that the crack parts are being found out (assuming they are within .5" or so of the score line)
Electronics Forum | Sat Feb 05 13:25:32 EST 2005 | etienne
Just a basic suggestion.... Inspect the nozzle placing the component...because that is the only medium, apart from the PCB design, which can be causing the damage. It occurred in my Department.
Electronics Forum | Wed Jun 24 18:41:23 EDT 1998 | Bill Chrisitian
| Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exactl
Electronics Forum | Thu Jun 25 11:53:09 EDT 1998 | Dave F
| | Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exac
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