Electronics Forum | Wed May 09 01:23:17 EDT 2001 | GregH
Hi, My Bottomside component pads are 1:1 with my topside land sizes/dimensions. I have difficulties catching solders on my bottomside smd chips (SMB Diodes, 0805 RC Chips). What should the bottomside components for wave soldering be greater than my t
Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno
I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
Electronics Forum | Thu Jan 29 14:24:56 EST 2004 | rick
What kind of cleaning method you recommend for PCB - double side SMD (fine pitch and BGA components) and THT elements (PCB are for microwave application!!). Process technology no-clean.We have to remove grease-fingerprints, dust etc. It is low volume
Electronics Forum | Wed Nov 14 09:48:56 EST 2012 | rway
It depends on what type of packages you will be working with. Will you be working with BGA/LGA devices or QFP. For QFP, Pace is a really good system. I would recommend a power supply with 3 ports: iron, de-solder, and hot air. You can replace mos
Electronics Forum | Mon Jul 19 14:58:50 EDT 2004 | mattkehoe
We have a need for expert opinions on a solderability issue. Our company prints and then reflows solder paste with no components in place. It is then washed and flattened with a special flattening machine. Usually, the paste fuses and spreads out
Electronics Forum | Wed Sep 22 14:22:54 EDT 2021 | oclsc
Hi Forum. Is there anyone who can tell if an empty PCB with no SMD components mounted and HAL surface will get a less solderability after been running through reflow (convection). Eg. when testing empty PCB with temperture data logger. Regards Ole
Electronics Forum | Thu Jun 15 22:06:15 EDT 2000 | Dreamsniper
Hi Raeto, 1. You do not have reflow oven. This means that you are not running Surface Mount Technology in your shop floor...am I correct? Why do you plan to have SMD's under your PCB's ? Can't you replace them with their PTH counter part and have th
Electronics Forum | Sat Jun 27 00:23:26 EDT 2009 | grantp
Hi, This is easy. If your just doing prototypes, then you could get by with a syringe of solder paste and a hear gun. You can put down a little solder paste on each page and then place the passives and heat gun the board. If you have other active p
Electronics Forum | Fri May 14 12:30:58 EDT 2010 | padawanlinuxero
Is there a way or process to use the screen printer to put solder paste in the thru holes ? The thing is that we are trying to put a thru hole in the same reflow oven with the other SMD components can some one explain how this work? thanks
