Electronics Forum | Fri Jul 15 16:53:56 EDT 2005 | davef
Questions are: * Are you sure there was solder on the pad prior to placing the component? * Is there solder on the lead, but not on the pad?
Electronics Forum | Mon Jul 18 09:35:42 EDT 2005 | stepheniii
If it were other machines I would suggest the possibility of air kiss blowing the solder away, but mydata's have a release to make sure the air kiss never gets too high. Unless it is not pointing 90 degrees away from the machine like mydata recommend
Electronics Forum | Wed Jul 20 02:48:43 EDT 2005 | grantp
Hi, What's really interesting about your photos is there is solder paste on top of the component. If it was blowing the solder off the board you would see solder paste splatter away from the component. But the solder paste is on top of the compon
Electronics Forum | Fri Jul 15 14:16:09 EDT 2005 | seaK
We have this problem for a long time. It happens to 3 new Mydata MY-9 machine. When pick and place resistor array 0408 (different value, top and bottom side), the solder paste in the middle two terminals missing occasionally. Thought it's because noz
Electronics Forum | Mon Jul 18 18:02:31 EDT 2005 | seaK
Thanks for the response..... The solder is actually printed okay prior to SMT.... And after placing, found missing solders at middle terminals of 0408 resistor arrays.... Package library is checked, component spec looks fine... I am suspecting the
Electronics Forum | Thu Jul 21 02:45:51 EDT 2005 | Base
Probably very far-fetched, but I can think of a scenario like this: - machine picks up a component - between vision and placement the part is lost, but the loss is not detected due to oversize tool, which causes the amount of vacuum drop to go unnot
Electronics Forum | Tue Jul 19 06:17:20 EDT 2005 | Rob
Have you tried a smaller nozzle? I'm wondering if the air is escaping through the cut outs on the device on the air kiss stage.
Electronics Forum | Tue Jul 19 12:07:03 EDT 2005 | CLampron
Sr tech, It is in the PCB header information. F2 from the layout editor then F1 to view through the camera. Regards Chris
Electronics Forum | Tue Jul 19 12:10:04 EDT 2005 | CLampron
Sr. tech, The mount tool test position is what I am refering to. The function of this is to determine the placement plane of the board. The mount plane will change if the board is thicker so thickness is relavent. regards Chris
Electronics Forum | Thu Jul 21 11:13:11 EDT 2005 | Scott B
Have you tried running the machine in stepper mode (Ctrl+S). This will allow you to hold and view the machine at each stage of the placement cycle. This may help determine if it is false placement, vacuum or kiss-off. We find this useful when trying
