Electronics Forum | Mon Mar 30 08:11:22 EST 1998 | Derek Drabenstadt
Does anyone have any experience with fired-silver/platinum/palladium lead terminations soldering. I have had issues on nickel over gold plated boards but not with HASL'd boards with tin/lead pads. Is this the norm?
Electronics Forum | Sun May 02 18:52:36 EDT 1999 | JohnW
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
Electronics Forum | Mon May 03 09:42:45 EDT 1999 | Mike McMonagle
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
Electronics Forum | Wed Apr 01 02:19:10 EST 1998 | Eldon Sanders
Yes, norm it is. Look back to February 98 discussion on this issue.
Electronics Forum | Thu Apr 02 08:26:36 EST 1998 | Steve Gregory
| Yes, norm it is. Look back to February 98 :discussion on this issue. Norm, That discussion does deal with palladium coated leads, but when I read your statement about silver/palladium fired terminations, I'm assuming that you're referring to
Electronics Forum | Tue Aug 31 11:57:03 EDT 2004 | Kris
Hi Any body have any issues soldering tin lead solder paste with lead free terminations ? Components are leaded devices and chip components have read the theoritical discussions on the forum, need to know if any body has seen any real issues tod
Electronics Forum | Mon Dec 14 10:53:10 EST 1998 | Earl Moon
| Has anyone had any experience with using this alternative plating process? Some board houses are pushing toward this plating. Is there any long term data on this process? Any problems experienced with smt and thru-hole? I've heard tin whiskers to b
Electronics Forum | Fri Dec 16 08:16:41 EST 2005 | davef
Heat cycles deplete the pure tin layer. Each solder cycle reduces the tin thickness by ~0.1 micron (4 uin). So, if you start with a thin imm tin coating you'll have problems after multiple heat cycles. Steve Wentz says, "In almost every case I've
Electronics Forum | Fri Dec 16 13:31:03 EST 2005 | gpaelmo
Thanks for your response.
Electronics Forum | Fri Dec 16 13:31:28 EST 2005 | gpaelmo
Thanks for your response.
