Electronics Forum | Fri Dec 03 19:44:34 EST 1999 | Russ
Hello all, I am in the process of converting our facility to noclean processes. So far I am experiencing troubles with soldering to gold finishes. The finish is an H.P. type1. The solder joints appear dull and grainy. They seem to be very strong
Electronics Forum | Mon Dec 13 00:05:28 EST 1999 | Dennis O'Donnell
I can't figure out why everyone is plating everything with gold. According to the J Standard, gold plating should be removed before soldering to the surface. The gold, when left on the surface to be soldered will contaminate the solder joint and ca
Electronics Forum | Mon Dec 06 09:16:22 EST 1999 | Dave F
Russ: Three things: 1 Wolfgang is 100% correctamundo about the slow dissolution rate of gold 2 Shear stength of the gold 63/37 solder connection decreases rapidly, as the gold content of the solder connection increases above 2%. 3 There are many
Electronics Forum | Sat Dec 04 09:33:18 EST 1999 | Christopher Lampron
Hello Russ, I believe that the dullness in color of the solder joint is related to the gold finish on the pads. I have had done alot of thru hole soldering of gold pins as well as SMT on gold finish and have seen the condition that you are talking a
Electronics Forum | Mon Dec 13 16:07:38 EST 1999 | Travson
Russ, Regarding your no clean soldering to gold. We have been doing that for about three years now. We have been using 62/36/2% silver solder paste. I have not done any thorough testing as to joint strength but the finish is shinier. It looks li
Electronics Forum | Mon Dec 13 10:12:45 EST 1999 | John Thorup
Hi Dennis The gold plating on a circuit board is present to protect the nickle plating from corrosion. The layer is so thin that as it goes into solution in the solder it constitutes only a small percentage of the total joint. It is commonly accept
Electronics Forum | Tue Dec 07 08:11:04 EST 1999 | Wolfgang Busko
Hi Russ, there�s something I don�t understand about the measures you took. I guess that TAL means time above liquidous and shortening of that time can result in bad dissolution of the protective Au-layer. The necessary time for the Au to mix with you
Electronics Forum | Mon Dec 06 03:54:57 EST 1999 | Chris May
Hi Russ, I have a similar situation. I have been told that this can be caused by the nickel, over which the gold is plated, can result in suspect joints, embrittlement etc. Some joints can even be weak and broken without much force on some of my boa
Electronics Forum | Mon Dec 06 12:37:57 EST 1999 | Russ
Christopher, in response to your request concerning if I have the same issue using OA fluxes the answer would be no. This finish works well with all of our current Water Soluble fluxes. As a note, I have done some further testing and so far it see
Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ
Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to
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