Electronics Forum | Thu Jan 25 13:20:17 EST 2007 | slthomas
Are you running a lead free process? If not, have you identified these as lead free components? If so, have you increased the temps in your profile to accomodate that? After that, I'd look for a AgPd (silver/palladium) or some other such PITA platin
Electronics Forum | Thu Jul 30 13:52:34 EDT 2009 | davef
Thoughts are: * 215-220 temperature at the leads is not real hot for leaded assembly. * It's peculiar for component leads to dewet. Sometimes non-wetting occurs along the edge of the lead where the lead is not plated. * How do the leads of a removed
Electronics Forum | Fri Oct 14 10:55:07 EDT 2005 | Mika
We have a simular problem with Ni/Au; especially whith pcb thickness more than 1.8mm. Note: These boards have been through reflow process also. 1.)Is there a maximum board thickness where it would be almost impossible to get a decent hole fil? 2.)Wi
Electronics Forum | Mon Feb 23 10:39:37 EST 1998 | Igmar
| I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would appre
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
Electronics Forum | Mon Feb 23 13:27:30 EST 1998 | Doug Romm
Gary, I'm pretty much the main contact at TI for palladium lead finish questions. We have a web site at "http://www.ti.com/sc/docs/asl/palladm/index.htm" which has technical papers I have written on the subject. Also, you'll find the Pd Lead Finish
Electronics Forum | Mon Apr 26 17:09:05 EDT 2021 | kwalker
Sounds like you are getting oxidation of the nickel under the gold layer. If the gold is porous it will allow the nickel underneath to oxidize, which is the dark dull layer you are seeing, and why when you apply flux it solders just fine - the flux i
Electronics Forum | Wed Feb 25 12:55:23 EST 1998 | N.J Bateman
| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would
Electronics Forum | Wed Feb 25 12:55:15 EST 1998 | N.J Bateman
| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would
Electronics Forum | Fri Oct 14 09:58:13 EDT 2005 | patrickbruneel
Here's what I believe is happening. The main difference between the HASL boards and the gold plated boards is that HASL boards are pre-soldered. HASL boards need very little flux activity to get good hole fill and the machine settings have a wide pro
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