Electronics Forum | Mon Sep 13 05:02:19 EDT 1999 | Brian
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Mon Sep 13 06:23:06 EDT 1999 | Earl Moon
| | We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems wi
Electronics Forum | Fri Sep 10 14:32:49 EDT 1999 | John Thorup
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Wed Dec 19 09:56:20 EST 2001 | guicho_v
I'm new in SMT world, and I've got my 1st challenge: I'm having de-wetting issues with a specific IC 160 pins MQFP (six location, failure is random), where one pin has de-wetting (solder reflow OK, and there is evidence of having contact the past and
Electronics Forum | Fri Dec 29 08:14:19 EST 2006 | joey_dragon
Thank you for the quick reply! Actually, the "type B" I referred to applies to a flex cable that can be found in this page: http://www.tennrich.com/trtw/cabling_3.php It is a reverse Engineering project and, from what I can see, there is, indeed,
Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser
Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates
Electronics Forum | Mon May 02 12:35:33 EDT 2016 | adamjs
Or try : http://www.sipad.com/ I think sipad is incredibly cool and would be the perfect solution, but is way too expensive. We're paying $0.80/each for four-layer ENIG boards, 50cm^2 with 0.125mm trace/space and 0.8mm-pitch LGA landings in lots of
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Thu Jan 29 09:18:36 EST 2015 | davef
Nichrome, manganin, phosphor bronze etc are easy to solder ... the hard part is removing the corrosion * Manganin: 86% copper, 12% manganese, 2% nickel. Often, it's used in making cryogenic measurements, due to its low heat loss. * Select a flux for
Electronics Forum | Tue Sep 24 12:30:11 EDT 2002 | Claude_Couture
I'm just shooting ideas here, but maybe a via hole in the middle of the solder pad would drain the excess solder by capillary force? Or using a tin plated PCB and printing flux only, then place and reflow. depending on the thickness of the tin plati
