Electronics Forum | Fri Oct 14 11:56:49 EDT 2005 | patrickbruneel
Mika, 1.) Is there a maximum board thickness where it would be almost impossible to get a decent hole fil? Answer: The thicker the board the further the solder has to travel and the more you depend on solderability of boards and components, machine
Electronics Forum | Wed Feb 25 17:02:05 EST 1998 | Doug Romm
Just a comment to clarify this discussion. Typically chip caps and other passive components that use palladium plated to the end of the component are very different from the TI nickel/palladium plated IC components (leaded devices). The main di
Electronics Forum | vincentl |
Thu Sep 20 14:17:36 EDT 2018
Electronics Forum | Thu Aug 06 19:20:09 EDT 2009 | boloxis
easy, just dip the ICs on a very weak solution of Nitric Acid, by very weak I mean like drops of Fuming Nitric acid in a half full DI water beaker. Place the beaker on a Ultrasonic bath and dip/shake the ICs in the solution in 5~ 10 seconds only. You
Electronics Forum | Fri Feb 20 20:33:16 EST 1998 | Steve Gregory
The biggest difference between the two, is solder joint appearance. What I noticed mainly is that the solder does not wet and flow as readily to a palladium coated lead as it does with a tin/lead coated lead. When you look at a palladium coated lead
Electronics Forum | Thu Jan 25 16:58:53 EST 2007 | wagoner
We are using tin-lead solder. The components could be lead free components, they probably are. I will check the plating on the components and investigate changing it.
Electronics Forum | Fri Oct 14 14:00:35 EDT 2005 | patrickbruneel
Mika, If I understand you correctly you compare hole fill of Ni/Au plated boards in a lead-free process with HASL 63/37 boards soldered with leaded solder. If this is the case you might be facing the challenges in Pb free wave soldering with the lim
Electronics Forum | Fri Feb 20 09:41:11 EST 1998 | Chrys Shea
| I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would appre
Electronics Forum | Mon Jun 27 09:38:30 EDT 2005 | Bob R.
What problems are the quality people seeing? I hope they aren't expecting a toe fillet. QFNs are typically cut from an array after plating. This leaves exposed copper on the sides of the part. We'll often see smearing from the sawing process that
Electronics Forum | Thu Oct 13 15:41:30 EDT 2005 | lyrtech
Hi, We have a customer who give us a 20K board contract each year. It's only thru-hole components.The baord is HASL plated. So we pass it into our wave. No problems. Recently, our customer decided to go into GOLD PLATED finish. We take the same re
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