Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
Electronics Forum | Mon Dec 16 09:36:54 EST 2002 | russ
I have never had this problem. It sounds like you are right in imagining that there must have been a bad supplier of PCBS or an inadequate design rule being followed, or a very bad wave process to have this cracking over wave solder. Some books requ
Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
Electronics Forum | Thu Jun 03 18:51:25 EDT 2021 | emeto
It seems like some oxidation that flux is able to fix on the soldered pads. Is it looking like this before you reflow?
Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef
Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o
Electronics Forum | Tue Feb 23 08:46:11 EST 2021 | dianau
Hello, I have a topic with vias discoloration(that's what supplier said) and I don't know if it's an corrosion problem or something else. I believe that maybe the PCB's are not storage properly. I must mention that aren't any problem at soldering. D
Electronics Forum | Mon Mar 23 15:41:46 EST 1998 | Stuart Adams
Should I use thermals or direct connects on vias from BGA pads to power planes. The via is connected to the BGA pad via a short 8mil trace.
Electronics Forum | Tue Sep 14 16:23:54 EDT 2004 | dan
What is your cure time for the mask?
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Electronics Forum | Wed Sep 15 22:52:58 EDT 2004 | pdeuel
We had same problem. Solder balls appeared on top side of board and led to damaged second side stencles. We worked around problem by running blank boards thru oven and inspecting and removing solder before processing boards with parts.
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