Electronics Forum | Tue Apr 01 19:23:12 EDT 2008 | guhansub1
Just curious...What is the gap between the pads? If it's less than 3 mm, it's recommended to do gang relief. Otherwise the soldermask will peel off during rework.
Electronics Forum | Wed Mar 11 18:28:03 EDT 2015 | gregoryyork
Hi its undercured solder resist which leaves a clear waxy/oily residue and can be seen as brown tar/oil in the molten solder wave. This also causes MicroSolder Balling and some snail trails of solder pick up and worst case bridging and peeling resist
Electronics Forum | Wed Jul 09 04:57:11 EDT 2003 | Matt Kehoe
Our company applies solid solder to surface mount lands. While processing a micro BGA design we had some pads fall off, peel, whatever you might call it, from the surface of the board when touched "GENTLY" with the tip of a blade to remove a small s
Electronics Forum | Sat Apr 21 08:26:57 EDT 2007 | Cmiller
Has anyone experienced a problem with conformal coating adhesion to IS-410 boards? We are having problems with one suppliers boards. IS-410 boards from other suppliers are fine and all FR-4 boards that I have looked at are fine. We are using Conap
Electronics Forum | Mon Oct 06 12:37:18 EDT 2003 | ramanandkini
It was a nice discussion. What I did here was a thermal shock test 1 hour@ +90 deg.c and immediately 1 hour @ -40 deg.c. The second test I did was a high humudity test for a week. After each test, I carried out a peel test with scotch tape. Those bo
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