Electronics Forum: solid vias (Page 1 of 4)

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Mon May 05 11:48:33 EDT 2003 | mk

We have had good luck with via in pads using solid solder deposition. Please contact me off line or provide a number I can call. Thanks Matt Kehoe m.j.kehoe@att.net

QFN voiding levels

Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman

Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages

Plated through via's in pads.

Electronics Forum | Wed Feb 05 17:37:40 EST 2003 | mk

Investigate "Solid Solder Deposition"

Processing questions - PCB and BGA's

Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep

We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f

BGA via in pad

Electronics Forum | Fri Mar 16 17:15:51 EDT 2007 | davef

Ask the board fabricator to: * Fill the vias with resin. * Then metalize and copper plate the filled via along with the pad. * Then plate with solderability protection. This results in what appears to be a solid pad. For more, look here: http://www

Re: White residue on PCB's

Electronics Forum | Fri Oct 13 05:21:08 EDT 2000 | Robert Steltman

Looking at the original post, it seems that the white residue is formed on the board after wave soldering and becomes evident when it has been left standing for a while. From what I understand, it seems that the solids content of the "no clean" flux

Wave Solder - solder bubbles/outgassing??

Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon

Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to

RMA vs No clean

Electronics Forum | Thu Jan 16 05:42:18 EST 2003 | nifhail

I've a query. I have one new Customer whom insisted us to use RMA paste on their product. The problem is, on some of their products they use via hole as the test point in where all the PCB finished are ENTEK and as usual I have to print solder paste

Re: Providing Thermal Relief On Vias/Like A Wagon Wheel??

Electronics Forum | Thu Jun 04 09:25:21 EDT 1998 | Chrys

| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo

Re: Trapped Flux Under Component

Electronics Forum | Tue Nov 30 16:50:20 EST 1999 | Dave F

Greg: It depends on the specifics of the flux you are using. You didn�t say. Generally, using a: � "No-clean flux" should create no flux entrapment problems for most applications. � RMA with 25% or more solids as a "no-clean" should create no flu

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