Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
Electronics Forum | Tue May 16 15:53:09 EDT 2006 | Manvendra Verma
What is the solution for removing epoxy on BGA ics?
Electronics Forum | Fri Jun 02 22:46:21 EDT 2006 | mika
Is this the new Xbox 360 You are talking about? So the "modchip" doesn't work? Hmm... Can You please tell us what the purpose of the dissolution of the epoxy on the BGA You would like to do? /
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Thu Aug 21 20:43:21 EDT 2003 | davef
We just plant BGA in the paste when we place them with a standard flex machine. You know, just set your placement force to get the balls into the paste. Justin is correct about collapse.
Electronics Forum | Thu Aug 21 16:58:25 EDT 2003 | justin
With a eutectic ball, you'll see about a 50% collapse. This negates that .008" issue you're referring to. With a high temp ball, you don't enjoy the same freedom regarding ball collapse. Dave is correct, though. We recently got IBM to sign up to
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Fri Apr 17 21:46:18 EDT 1998 | Matthias Mansfeld
I plan to design a multichip module which contains 1 chip with about 200 pads and 2 chips with about 50 pads, no other components.The whole module shall replace as intermediate solution a single chip CPU in QFP208. Thus, the MCM itself must have t
Electronics Forum | Thu Oct 05 12:10:36 EDT 2017 | duchoang
Thank you for your replies. We use No-Clean Paste and some customers do not want any residue left around solder joint even so, so little. They want the residue washed completely. If we use water-soluble flux, we still need to wash, anyway. Their conc
